Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems von Wymysłowski, Artur

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Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems von Wymysłowski, Artur

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Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems von Wymysłowski, Artur

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Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems von Wymysłowski, Artur

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STRENGTH ANALYSIS OF SOLDER JOINTS USED IN MICROELECTRONICS PACKAGING von Wymyslowski, Artur, Jankowski, Krystian

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Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems von Wymysłowski, Artur

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2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems von Wymysłowski, Artur

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Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems von Wymysłowski, Artur

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Adhesion work analysis through molecular modeling and wetting angle measurement von Król, Dawid Jan, Wymysłowski, Artur, Allaf, Kamil Nouri

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Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials von WYMYSLOWSKI, Artur, DOWHAN, Lukasz

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Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems von Wymysłowski, Artur

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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems von Wymysłowski, Artur

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Multi-objective decision support system in numerical reliability optimization of modern electronic packaging von Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer

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Numerical prototyping methods in microsystem accelerometers design von Dowhań, Łukasz, Wymysłowski, Artur, Kaliciński, Stanisław, Janus, Paweł

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Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods von Dowhań, Łukasz, Wymysłowski, Artur, Janus, Paweł, Ekwińska, Magdalena, Wittler, Olaf

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An approach of numerical multi-objective optimization in stacked packaging von Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer

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Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017] von van Driel, Willem D., Wymyslowski, Artur

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Numerical approach to characterization of thermally conductive adhesives von Fałat, Tomasz, Wymysłowski, Artur, Kolbe, Jana

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Lab-on-Chip Platform for Culturing and Dynamic Evaluation of Cells Development von Podwin, Agnieszka, Lizanets, Danylo, Przystupski, Dawid, Kubicki, Wojciech, Sniadek, Patrycja, Kulbacka, Julita, Wymyslowski, Artur, Walczak, Rafal, Dziuban, Jan A.

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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems von Wymysłowski, Artur, Vandevelde, Bart, Andersson, Dag

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