C5L2: a controversial receptor of complement anaphylatoxin, C5a von Li, Rui, Coulthard, Liam G., Wu, M. C. L., Taylor, Stephen M., Woodruff, Trent M.

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Label-free sensing of exosomal MCT1 and CD147 for tracking metabolic reprogramming and malignant progression in glioma von Thakur, A., Qiu, G., Xu, C., Han, X., Yang, T., Ng, S. P., Chan, K. W. Y., Wu, C. M. L., Lee, Y.

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Review and comparison of shearography and active thermography for nondestructive evaluation von Hung, Y.Y., Chen, Y.S., Ng, S.P., Liu, L., Huang, Y.H., Luk, B.L., Ip, R.W.L., Wu, C.M.L., Chung, P.S.

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Synthesis of Hierarchical Porous ZnO Disklike Nanostructures for Improved Photovoltaic Properties of Dye-Sensitized Solar Cells von Wang, J. X, Wu, C. M. L, Cheung, W. S, Luo, L. B, He, Z. B, Yuan, G. D, Zhang, W. J, Lee, C. S, Lee, S. T

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The wettability and microstructure of Sn-Zn-RE alloys von WU, C. M. L, LAW, C. M. T, YU, D. Q, WANG, L

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Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys von WU, C. M. L, YU, D. Q, LAW, C. M. T, WANG, L

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Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys von Law, C M T, Wu, C M L, Yu, D Q, Wang, L, Lai, J K L

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Creep behavior of eutectic Sn–Ag lead-free solder alloy von Huang, M. L., Wang, L., Wu, C. M. L.

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N–P transition sensing behaviors of ZnO nanotubes exposed to NO2 gas von Wang, J X, Sun, X W, Yang, Y, Wu, C M L

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Rare-earth additions to lead-free electronic solders: Lead-free electronic solders von WU, C. M. L, WONG, Y. W

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Valproic acid selectively increases vascular endothelial tissue‐type plasminogen activator production and reduces thrombus formation in the mouse von Larsson, P., Alwis, I., Niego, B., Sashindranath, M., Fogelstrand, P., Wu, M. C. L., Glise, L., Magnusson, M., Daglas, M., Bergh, N., Jackson, S. P., Medcalf, R. L., Jern, S.

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The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements von WU, C. M. L, YU, D. Q, LAW, C. M. T, WANG, L

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Creep resistance of tin-based lead-free solder alloys von HUANG, M. L, WU, C. M. L, WANG, L

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Properties of lead-free solder alloys with rare earth element additions von Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.

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AGCM simulations of intraseasonal variability associated with the Asian summer monsoon von Waliser, D. E., Jin, K., Kang, I.-S., Stern, W. F., Schubert, S. D., Wu, M. L. C., Lau, K.-M., Lee, M.-I., Krishnamurthy, V., Kitoh, A., Meehl, G. A., Galin, V. Y., Satyan, V., Mandke, S. K., Wu, G., Liu, Y., Park, C.-K.

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Microstructural evolution of oxides and semiconductor thin films von CHEN, Z. W, JIAO, Z, WU, M. H, SHEK, C. H, WU, C. M. L, LAI, J. K. L

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Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy von Zhao, N., Huang, M. L., Wu, C. M. L.

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Creep behavior of eutectic Sn-Cu lead-free solder alloy von WU, C. M. L, HUANG, M. L

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Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging von HUANG, M. L, WU, C. M. L, LAI, J. K. L, CHAN, Y. C

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The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering von XIAOYING LIU, MINGLIANG HUANG, YANHUI ZHAO, WU, C. M. L, LAI WANG

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