MICROELECTRONIC PACKAGE WITH REDUCED THROUGH-SUBSTRATE ROUTING von Mortensen, Russell K, Sain, Arghya, Polka Wood, Lesley A

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SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT von Yao, Jimin, Aspandiar, Raiyomand F, Prakash, Anna M, Agrawal, Ankur, Wood, Lesley A. Polka, Helms, Kayleen L. E, Agwai, Abigail G, Dobriyal, Priyanka, Xu, Ann J

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In-package microelectronic apparatus, and methods of using same von ICHIKAWA KINIYA, POLKA WOOD LESLEY A, DATTAGURU SRIRAM, TOMITA YOSHIHIRO, SANKMAN ROBERT L

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IN-PACKAGE MICROELECTRONIC APPARATUS, AND METHODS OF USING SAME von ICHIKAWA KINIYA, DATTAGURU SRIRAM, WOOD LESLEY A. POLKA, TOMITA YOSHIHIRO, SANKMAN ROBERT L

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In-package microelectronic apparatus, and methods of using same von POLKA WOOD LESLEY A, ICHIKAWA KINYA, DATTAGURU SRIRAM, TOMITA YOSHIHIRO, SANKMAN ROBERT L

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In-package microelectronic apparatus, and methods of using same von Dattaguru, Sriram, Polka Wood, Lesley A, Tomita, Yoshihiro, Ichikawa, Kinya, Sankman, Robert L

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In-pakage microelectronic apparatus, and methods of using same von POLKA WOOD LESLEY A, ICHIKAWA KINYA, DATTAGURU SRIRAM, TOMITA YOSHIHIRO, SANKMAN ROBERT L

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