The fundamentals of thermal-mass diffusion analogy von Wong, E.H.

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Microbial growth inhibition using functionalized carbon nanotubes as an alternative therapy von Saleemi, M.A., Fouladi, M.H., Yong, P.V.C., Wong, E.H.

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Creep fatigue models of solder joints: A critical review von Wong, E.H., van Driel, W.D., Dasgupta, A., Pecht, M.

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In vitro host immune response against Acinetobacter baumannii infection using A549 cell line von Mea, H.J., Madhavan, P., Palanisamy, N.K., Yong, P., Wong, E.H.

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Inhibition of sessile and biofilm growth in various Aspergillus species by allicin associated with disruption to structural changes in cell wall von Choo, S., Chong, P.P., Tay, S.T., Wong, E.H., Madhavan, P., Yong, P.

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Correlation of host immune response to internalized and extracellular bacterial strains of streptococcus pneumoniae of various serotypes von Palanisamy, N., Nor, F. Mohd, Rahim, E. Abdul, Mohd-Zain, Z., Hussaini, J., Wong, E.H., Adnan, A.

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A review of board level solder joints for mobile applications von Wong, E.H., Seah, S.K.W., Shim, V.P.W.

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Stout hourglass – The ideal shape for robust solder joints von Wong, E.H.

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Angiopoietin: A TIE(d) Balance in Tumor Angiogenesis von Shim, Winston S N, Ho, Ivy A W, Wong, Philip E H

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Derivation of novel creep-integrated fatigue equations von Wong, E.H.

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A new creep fatigue model for solder joints von Wong, E.H.

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Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

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Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions von Wong, E.H., Liu, Johan

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Moisture diffusion modeling – A critical review von Wong, E.H., Park, S.B.

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Angiographic, optical coherence tomography and histology findings from combination of a drug-coated balloon with an everolimus-eluting stent in a porcine model von Ong, Paul J.L, Kubo, Takashi, Watson, Timothy J, Seah, Agnes S.P, Wong, Philip E.H, Akasaka, Takashi

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Tri-Layer Structures Subjected to Combined Temperature and Mechanical Loadings von Wong, E.H., Wong, C.K.

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Creep-integrated fatigue equation for metals von Liu, Dan, Pons, Dirk John, Wong, E.H.

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Interfacial stresses in sandwich structures subjected to temperature and mechanical loads von Wong, E.H.

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An overview of recent development in therapeutic drug carrier system using carbon nanotubes von Saleemi, M.A., Kong, Y.L., Yong, P.V.C., Wong, E.H.

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Effect of temperature on the cure shrinkage measurement of non-conductive adhesives for flip chip interconnects von Yu, H., Mhaisalkar, S.G., Wong, E.H.

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