Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy von Kopycinska-Müller, M., Clausner, A., Yeap, K.-B., Köhler, B., Kuzeyeva, N., Mahajan, S., Savage, T., Zschech, E., Wolter, K.-J.

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Creep of thermally aged SnAgCu-solder joints von Wiese, S., Wolter, K.-J.

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Simulation of capacity and cost for the planning of future process chains von Lange, J., Bergs, F., Weigert, G., Wolter, K.-J.

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Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders von Wiese, S., Wolter, K.-J.

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Dual resonance excitation system for the contact mode of atomic force microscopy von Kopycinska-Müller, M., Striegler, A., Schlegel, R., Kuzeyeva, N., Köhler, B., Wolter, K.-J.

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The effect of downscaling the dimensions of solder interconnects on their creep properties von Wiese, S., Roellig, M., Mueller, M., Wolter, K.-J.

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Cyclooxygenase inhibitors differentially modulate p73 isoforms in neuroblastoma von Lau, L M S, Wolter, J K, Lau, J T M L, Cheng, L S, Smith, K M, Hansford, L M, Zhang, L, Baruchel, S, Robinson, F, Irwin, M S

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Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods von Kopycinska-Müller, M, Yeap, K-B, Mahajan, S, Köhler, B, Kuzeyeva, N, Müller, T, Zschech, E, Wolter, K-J

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μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization von Saettler, P., Hecker, M., Boettcher, M., Rudolph, C., Wolter, K.J.

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Modular Design of Fully Integrated Counting Line Detectors von Lohse, T., Krüger, P., Heuer, H., Oppermann, M., Torlee, H., Wolter, K.-J., Meyendorf, N.

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Fodel microresistors––processing and basic electrical properties von Dziedzic, A, Rebenklau, L, Golonka, L.J, Wolter, K.-J

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Impedance as guidance for electrode placement in intraoperative monitoring of nerve fibers von Rodriguez, L Diaz, Varga, M, Wolter, J K, Pliquett, U

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Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading von Meier, R, Kraemer, F, Wiese, S, Wolter, K, Bagdahn, J

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Characterization of the annealing behavior for copper-filled TSVs von Saettler, P., Boettcher, M., Wolter, K.-J

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Bath chemistry and copper overburden as influencing factors of the TSV annealing von Saettler, P., Boettcher, M., Rudolph, Catharina, Wolter, K.-J

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Development of radiation resistant, direct converting X-ray line detectors in terms of their assembly technology von Lohse, T., Krüger, P., Heuer, H., Oppermann, M., Torlee, H., Zerna, T., Wolter, K.J., Meyendorf, N.

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Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging von Sohr, S., Rieske, R., Nieweglowski, K., Wolter, K.-J

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Reliability of embedding concepts for discrete passive components in organic circuit boards von Schwerz, R., Boehme, B., Roellig, M., Wolter, K.-J, Meyendorf, N.

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Assembly tolerance requirements for photonics packaging of multi-cell laser power converters von Rieske, R., Sohr, S., Nieweglowski, K., Wolter, K.-J.

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Reliability assessment of discrete passive components embedded into PCB core von Schwerz, R., Roellig, M., Osmolovskyi, S., Wolter, K-J

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