Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications von Eddahech, A., Briat, O., Woirgard, E., Vinassa, J.M.

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Characterization methods and modelling of ultracapacitors for use as peak power sources von Lajnef, W., Vinassa, J.-M., Briat, O., Azzopardi, S., Woirgard, E.

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A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization von Le Henaff, F., Azzopardi, S., Deletage, J.Y., Woirgard, E., Bontemps, S., Joguet, J.

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Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity von Youssef, T., Rmili, W., Woirgard, E., Azzopardi, S., Vivet, N., Martineau, D., Meuret, R., Le Quilliec, G., Richard, C.

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Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices von Arabi, F., Theolier, L., Martineau, D., Deletage, J.-Y., Medina, M., Woirgard, E.

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Identification and analysis of power substrates degradations subjected to severe aging tests von Woirgard, E., Arabi, F., Sabbah, W., Martineau, D., Theolier, L., Azzopardi, S.

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Ageing monitoring of lithium-ion cell during power cycling tests von Eddahech, A., Briat, O., Henry, H., Delétage, J.-Y., Woirgard, E., Vinassa, J.-M.

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How supercapacitors reach end of life criteria during calendar life and power cycling tests von Chaari, R., Briat, O., Delétage, J.Y., Woirgard, E., Vinassa, J.-M.

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Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach von Baccar, F., Azzopardi, S., Theolier, L., El Boubkari, K., Deletage, J-Y., Woirgard, E.

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Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions von El Brouji, H., Briat, O., Vinassa, J-M., Henry, H., Woirgard, E.

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Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling von Briat, O., Vinassa, J.-M., Bertrand, N., El Brouji, H., Delétage, J.-Y., Woirgard, E.

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Failure mechanism of trench IGBT under short-circuit after turn-off von Benmansour, A., Azzopardi, S., Martin, J.C., Woirgard, E.

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Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests von El Brouji, H., Briat, O., Vinassa, J.-M., Bertrand, N., Woirgard, E.

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New power module concept in PCB-embedded technology with silver sintering die attach von Tablati, A., Alayli, N., Youssef, T., Belnoue, O., Theolier, L., Woirgard, E.

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An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications von Micol, A., Zeanh, A., Lhommeau, T., Azzopardi, S., Woirgard, E., Dalverny, O., Karama, M.

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Assessment of the Trench IGBT reliability: low temperature experimental characterization von Azzopardi, S., Benmansour, A., Ishiko, M., Woirgard, E.

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Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation von Belmehdi, Y., Azzopardi, S., Benmansour, A., Delétage, J.-Y., Woirgard, E.

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A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation von Benmansour, A., Azzopardi, S., Martin, J.C., Woirgard, E.

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Power cycling tests for accelerated ageing of ultracapacitors von Briat, O., Lajnef, W., Vinassa, J.-M., Woirgard, E.

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Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions von Benmansour, A., Azzopardi, S., Martin, J.C., Woirgard, E.

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