Textured surfaces for deep drawing tools by rolling von Franzen, V., Witulski, J., Brosius, A., Trompeter, M., Tekkaya, A.E.

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High wear resistant deep drawing tools made of coated polymers von Witulski, J., Trompeter, M., Tekkaya, A.E., Kleiner, M.

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Thermally Sprayed Coatings as Effective Tool Surfaces in Sheet Metal Forming Applications von Franzen, V., Witulski, J., Brosius, A., Trompeter, M., Tekkaya, A. E.

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Listening In Action: Teaching Music in the Digital Age von Witulski, Christopher J

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Crossing Paths: Musical and Ritual Interactivity between The Ḥamadsha and Gnawa in Sidi Ali, Morocco von Witulski, Christopher J

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Crossing Paths: Musical and Ritual Interactivity between The ?amadsha and Gnawa in Sidi Ali, Morocco von Witulski, Christopher J

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The non-hydrostatic response of polymer melts as a pressure medium in sheet metal forming von Tekkaya, A. E., Hussain, M. M., Witulski, J.

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Charge Collection and Charge Sharing in a 130 nm CMOS Technology von Amusan, O.A., Witulski, A.F., Massengill, L.W., Bhuva, B.L., Fleming, P.R., Alles, M.L., Sternberg, A.L., Black, J.D., Schrimpf, R.D.

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Ultrawide‐Bandgap Semiconductors: Research Opportunities and Challenges von Tsao, J. Y., Chowdhury, S., Hollis, M. A., Jena, D., Johnson, N. M., Jones, K. A., Kaplar, R. J., Rajan, S., Van de Walle, C. G., Bellotti, E., Chua, C. L., Collazo, R., Coltrin, M. E., Cooper, J. A., Evans, K. R., Graham, S., Grotjohn, T. A., Heller, E. R., Higashiwaki, M., Islam, M. S., Juodawlkis, P. W., Khan, M. A., Koehler, A. D., Leach, J. H., Mishra, U. K., Nemanich, R. J., Pilawa‐Podgurski, R. C. N., Shealy, J. B., Sitar, Z., Tadjer, M. J., Witulski, A. F., Wraback, M., Simmons, J. A.

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Characterization of Digital Single Event Transient Pulse-Widths in 130-nm and 90-nm CMOS Technologies von Narasimham, B., Bhuva, B.L., Schrimpf, R.D., Massengill, L.W., Gadlage, M.J., Amusan, O.A., Holman, W.T., Witulski, A.F., Robinson, W.H., Black, J.D., Benedetto, J.M., Eaton, P.H.

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Ion-Induced Energy Pulse Mechanism for Single-Event Burnout in High-Voltage SiC Power MOSFETs and Junction Barrier Schottky Diodes von Ball, D. R., Hutson, J. M., Javanainen, A., Lauenstein, J.-M., Galloway, K. F., Johnson, R. A., Alles, M. L., Sternberg, A. L., Sierawski, B. D., Witulski, A. F., Reed, R. A., Schrimpf, R. D.

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Heat warnings and avoidance behavior: evidence from a bike-sharing system von Rabassa, Mariano J., Conte Grand, Mariana, García-Witulski, Christian M.

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Technology Scaling Comparison of Flip-Flop Heavy-Ion Single-Event Upset Cross Sections von Gaspard, N. J., Jagannathan, S., Diggins, Z. J., King, M. P., Wen, S-J., Wong, R., Loveless, T. D., Lilja, K., Bounasser, M., Reece, T., Witulski, A. F., Holman, W. T., Bhuva, B. L., Massengill, L. W.

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Effects of Breakdown Voltage on Single-Event Burnout Tolerance of High-Voltage SiC Power MOSFETs von Ball, D. R., Galloway, K. F., Johnson, R. A., Alles, M. L., Sternberg, A. L., Witulski, A. F., Reed, R. A., Schrimpf, R. D., Hutson, J. M., Lauenstein, J.-M.

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Influence of Radiation Environment Variability on Cumulative Heavy-Ion-Induced Leakage Current in SiC Power Devices von Johnson, R. A., Witulski, A. F., Sierawski, B. D., Ball, D. R., Galloway, K. F., Sternberg, A. L., Reed, R. A., Schrimpf, R. D., Alles, M. L., Lauenstein, J. M., Hutson, J.M.

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Single-Event Burnout of SiC Junction Barrier Schottky Diode High-Voltage Power Devices von Witulski, A. F., Arslanbekov, R., Raman, A., Schrimpf, R. D., Sternberg, A. L., Galloway, K. F., Javanainen, A., Grider, D., Lichtenwalner, D. J., Hull, B.

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"Thermally sprayed coatings as effective tool surfaces in sheet metal forming applications" von Franzen, V, Witulski, J, Brosius, A, Trompeter, M, Tekkaya, A.E

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Effects of Temperature and Supply Voltage on SEU- and SET-Induced Errors in Bulk 40-nm Sequential Circuits von Chen, R. M., Diggins, Z. J., Mahatme, N. N., Wang, L., Zhang, E. X., Chen, Y. P., Zhang, H., Liu, Y. N., Narasimham, B., Witulski, A. F., Bhuva, B. L., Fleetwood, D. M.

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Models and Algorithmic Limits for an ECC-Based Approach to Hardening Sub-100-nm SRAMs von Bajura, M.A., Boulghassoul, Y.., Naseer, R.., DasGupta, S.., Witulski, A.F., Sondeen, J.., Stansberry, S.D., Draper, J.., Massengill, L.W., Damoulakis, J.N.

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Estimating Terrestrial Neutron-Induced SEB Cross Sections and FIT Rates for High-Voltage SiC Power MOSFETs von Ball, D. R., Sierawski, B. D., Galloway, K. F., Johnson, R. A., Alles, M. L., Sternberg, A. L., Witulski, A. F., Reed, R. A., Schrimpf, R. D., Javanainen, A., Lauenstein, J.-M

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