Copper Ball Wedge Bonding to Copper Thick Film von Winkle, R.V, Cater, S.R

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Copper BallWedge Bonding to Copper Thick Film von Winkle, R.V., Cater, S.R.

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Interconnection and packaging of liquid crystal displays von Winkle, R.V., Wright, N.K.

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Effect of heat treatment on the shear strength and fracture modes of copper wire thermosonic ball bonds to Al-1% Si device metallization von Tomlinson, W.J., Winkle, R.V., Blackmore, L.A.

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Microwave Multiplexing on the Keck Array von Cukierman, A., Ahmed, Z., Henderson, S., Young, E., Yu, C., Barkats, D., Brown, D., Chaudhuri, S., Cornelison, J., D’Ewart, J. M., Dierickx, M., Dober, B. J., Dusatko, J., Fatigoni, S., Filippini, J. P., Frisch, J. C., Haller, G., Halpern, M., Hilton, G. C., Hubmayr, J., Irwin, K. D., Karkare, K. S., Karpel, E., Kernasovskiy, S. A., Kovac, J. M., Kovacs, A., Kuenstner, S. E., Kuo, C. L., Li, D., Mates, J. A. B., Smith, S., St. Germaine, T., Ullom, J. N., Vale, L. R., Van Winkle, D. D., Vasquez, J., Willmert, J., Zeng, L., Ade, P. A. R., Amiri, M., Basu Thakur, R., Bischoff, C. A., Bock, J. J., Boenish, H., Bullock, E., Buza, V., Cheshire, J., Connors, J., Crumrine, M., Duband, L., Hall, G., Harrison, S., Hildebrandt, S. R., Hui, H., Kang, J., Kefeli, S., Lau, K., Megerian, K. G., Moncelsi, L., Namikawa, T., Nguyen, H. T., O’Brient, R., Palladino, S., Pryke, C., Racine, B., Reintsema, C. D., Richter, S., Schillaci, A., Schwarz, R., Sheehy, C. D., Soliman, A., Steinbach, B., Sudiwala, R. V., Thompson, K. L., Tucker, C., Turner, A. D., Umiltà, C., Vieregg, A. G., Wandui, A., Weber, A. C., Wiebe, D. V., Wu, W. L. K., Yang, H., Yoon, K. W., Zhang, C.

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Nutrient Spiralling in Streams: Implications for Nutrient Limitation and Invertebrate Activity von Newbold, J. D., O'Neill, R. V., Elwood, J. W., Van Winkle, W.

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