Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders von Li, J.F., Mannan, S.H., Clode, M.P., Chen, K., Whalley, D.C., Liu, C., Hutt, D.A.

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Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects von Li, J.F., Mannan, S.H., Clode, M.P., Whalley, D.C., Hutt, D.A.

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A simplified reflow soldering process model von Whalley, D.C

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The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing von Zhang, Y., Liu, C., Whalley, D. C.

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Thermal fatigue life estimation and delamination mechanics studies of multilayered MEMS structures von Maligno, A.R., Whalley, D.C., Silberschmidt, V.V.

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A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin von Chen, K., Liu, C., Whalley, D.C., Hutt, D.A., Li, J.F., Mannan, S.H.

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RLC effects in fine pitch anisotropic conductive film connections von Dou, G, Chan, Y.C, Morris, J.E, Whalley, D.C

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Damage assessment in multilayered MEMS structures under thermal fatigue von Maligno, A R, Whalley, D C, Silberschmidt, V V

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The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers von Zhang, Y., Liu, C., Whalley, D. C.

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Solder ball failure mechanisms in plastic ball grid array packages von Zhong, C.H, Yi, S, Whalley, D.C

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The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films von Zhang, Yan, Liu, Changqing, Whalley, David C

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Novel techniques for electronic component removal von Stennett, A.D, Whalley, D.C

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Some optimum processing properties for anisotropic conductive adhesives for flip chip interconnection von Mannan, S H, Williams, D J, Whalley, D C

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A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images von Hyslop, S.M., Palmer, P.J., Whalley, D.C.

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Long-term seroprotection after an adolescent booster meningococcal serogroup C vaccination von de Whalley, Philip C S, Snape, Matthew D, Plested, Emma, Thompson, Ben, Nuthall, Elizabeth, Omar, Omar, Borrow, Ray, Pollard, Andrew J

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A simplified model of the reflow soldering process von Whalley, D.C.

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Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gap von Mannan, S. H., Hutt, D. A., Whalley, D. C.

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A simplified model of the reflow soldering process von Whalley, David C, Hyslop, Stuart M

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IGBT Package Design for High Power Aircraft Electronic Systems von Sarvar, Farhad, Whalley, David C, Low, Ming K

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Thermal Fatigue Life Estimation and Fracture Mechanics Studies of Multilayered MEMS Structures Using a Sub-Domain Approach von Maligno, A. R., Whalley, D. C., Silberschmidt, V. V.

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