Low temperature TLP bonding of Al2O3–ceramics using eutectic Au–(Ge, Si) alloys von Weyrich, Nico, Leinenbach, Christian

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Characterization of the isothermal solidification process in the Ni/Au–Ge layer system von Weyrich, Nico, Leinenbach, Christian

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Low temperature TLP bonding of [Al.sub.2][O.sub.3]-ceramics using eutectic Au- alloys von Weyrich, Nico, Leinenbach, Christian

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Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys von Weyrich, Nico, Jin, Shan, Duarte, Liliana I., Leinenbach, Christian

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Al2O3-Al2O3 and Al2O3-Ti Solder Joints-Influence of Ceramic Metallization and Thermal Pretreatment on Joint Properties von Leinenbach, Christian, Weyrich, Nico, Elsener, Hans-Rudolf, Gamez, Gerardo

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Al 2 O 3 – Al 2 O 3 and Al 2 O 3 – Ti Solder Joints—Influence of Ceramic Metallization and Thermal Pretreatment on Joint Properties von Leinenbach, Christian, Weyrich, Nico, Elsener, Hans‐Rudolf, Gamez, Gerardo

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Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys : Joining and Interface Design von WEYRICH, Nico, SHAN JIN, DUARTE, Liliana I, LEINENBACH, Christian

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Altered immune proteome of Staphylococcus aureus under iron-restricted growth conditions von Stentzel, Sebastian, Vu, Hai Chi, Weyrich, Anna Maria, Jehmlich, Nico, Schmidt, Frank, Salazar, Manuela Gesell, Steil, Leif, Völker, Uwe, Bröker, Barbara M.

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