Concept for a Damage-Tolerant Ceramic Composite with "Strong" Interfaces von Tu, Wen-Chiang, Lange, Fred F., Evans, Anthony G.

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High K Metal Gate Aluminum CMP Challenges and Solutions von Xu, Kun, Chen, Yufei, Iravani, Hassan, Wang, Yuchun, Swedek, Bogdan, Yu, May, Wang, You, Tu, Wen-chiang, Xia, Sherry, Karuppiah, Lakshmanan

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Liquid Precursor Infiltration Processing of Powder Compacts: I, Kinetic Studies and Microstructure Development von Tu, Wen-Chiang, Lange, Fred F.

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Post-CMP Cleaning of Copper/Hydrophobic Low-k Dielectric Films von Chen, Yufei, Ko, Sen-Hou, Xu, Kun, Wang, Yuchun, Tu, Wen-Chiang, Karuppiah, Lakshmanan

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Impact of Film Morphology on Chemical Mechanical Polishing of Tungsten von Xu, Kun, Shen, Shih-Haur, Fung, Jason, Iravani, Hassan, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Bogdan, Chang, Shou-Sung, Tu, Wen-chiang, Kitajima, Tomohiko, Mikhaylich, Katrina, Brown, Brian, Huey, Sidney, Redeker, Fritz

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Liquid Precursor Infiltration Processing of Powder Compacts: II, Fracture Toughness and Strength von Tu, Wen-Chiang, Lange, Fred F.

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Metal Clearing Process Control in Metal CMP von Xu, Kun, Carlsson, Ingemar, Liu, Tzu-Yu, Shen, Shih-Haur, Swedek, Bogdan, Wang, You, Xia, Xinyun, Bennett, Doyle, Tu, Wen-Chiang, Karuppiah, Lakshmanan

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CMP Process Technology in TSV Application von Wang, Yuchun, Gage, Max, Xia, Sherry, Tu, Wen-Chiang, Karuppiah, Lakshmanan

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CMP for Cu Interconnect with Advanced Barrier Materials von Wang, You, Gage, Max, Xu, Kun, Wang, Yuchun, Chen, Yufei, Xia, Sherry, Tu, Wen-chiang, Karuppiah, Lakshmanan

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CMP Process for Phase Change Materials von Liu, Feng Q, Ge, Chenhao, Xu, Kun, Ye, Mengqi, Wang, Yuchun, Chen, Yufei, Xia, Sherry, Rosenbusch, Anja, Duboust, Alain, Tu, Wen-Chiang, Karuppiah, Lakshmanan

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Improving Cu line Rs control using feed-forward information for CMP endpointing von Xiaoyuan Hu, Zhihong Wang, Wen-chiang Tu, Daxin Mao

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Modifying substrate thickness profiles von Wang, Zhihong, Zhang, Jimin, Tu, Wen-Chiang

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Inductive monitoring of conductive loops von Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang

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Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing von Jew, Stephen, Shen, Shih-Haur, Wang, Zhihong, Carlsson, Ingemar, Duboust, Alain, Zhang, Jimin, Swedek, Boguslaw A, Mai, David H, Tu, Wen-Chiang, Tran, Huyen

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Determination of gain for eddy current sensor von Iravani, Hassan G, Xu, Kun, Bennett, Doyle E, Shen, Shih-Haur, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Boguslaw A, Tu, Wen-Chiang

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INDUCTIVE MONITORING OF CONDUCTIVE LOOPS von Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang

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Inductive monitoring of conductive trench depth von Iravani, Hassan G, Wang, Zhefu, Lu, Wei, Wang, Zhihong, Benvegnu, Dominic J, Carlsson, Ingemar, Swedek, Boguslaw A, Tu, Wen-Chiang

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DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR von Iravani, Hassan G, Xu, Kun, Bennett, Doyle E, Shen, Shih-Haur, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Boguslaw A, Tu, Wen-Chiang

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W CMP Initiation Mechanism Study Using in-Situ Metrologies von Xu, Kun, Liu, Tzu-Yu, Shen, Shih-Haur, Wang, You, Carlsson, Ingemar, Swedek, Bogdan, Kitajima, Tomohiko, Tu, Wen-Chiang

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MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLISHING von Lee Harry Q, Brown Brian J, McClintock William H, Tu Wen-Chiang, Lu Wei, Zhang Jimin, Wang Zhihong

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