Significance and methodology: Preprocessing the big data for machine learning on TBM performance von Xiao, Hao-Han, Yang, Wen-Kun, Hu, Jing, Zhang, Yun-Pei, Jing, Liu-Jie, Chen, Zu-Yu

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Feedback on a shared big dataset for intelligent TBM Part I: Feature extraction and machine learning methods von Li, Jian-Bin, Chen, Zu-Yu, Li, Xu, Jing, Liu-Jie, Zhangf, Yun-Pei, Xiao, Hao-Han, Wang, Shuang-Jing, Yang, Wen-Kun, Wu, Lei-Jie, Li, Peng-Yu, Li, Hai-Bo, Yao, Min, Fan, Li-Tao

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Feedback on a shared big dataset for intelligent TBM Part II: Application and forward look von Li, Jian-Bin, Chen, Zu-Yu, Li, Xu, Jing, Liu-Jie, Zhang, Yun-Pei, Xiao, Hao-Han, Wang, Shuang-Jing, Yang, Wen-Kun, Wu, Lei-Jie, Li, Peng-Yu, Li, Hai-Bo, Yao, Min, Fan, Li-Tao

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Numerical simulation for compressive and tensile behaviors of rock with virtual microcracks von Chen, Xiao, Shi, Chong, Ruan, Huai-Ning, Yang, Wen-Kun

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Reliability analysis of a novel fan-out type WLP von Yew, Ming-Chih, Tsai, Mars, Hu, Dyi-Chung, Yang, Wen-Kun, Chiang, Kuo-Ning

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Spatial Multi-feature Segmentation of 3D Lidar Point Cloud von Yang, Wen-kun, Yuan, Xiao-pei, Chen, Xiao-feng, Guo, Rui

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Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact von Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Yew, Ming-Chih, Yang, Wen-Kun, Chiang, Kuo-Ning

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Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging von Ming-Chih Yew, Yuan, C.C.A., Chung-Jung Wu, Dyi-Chung Hu, Wen-Kun Yang, Kuo-Ning Chiang

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Probabilistic model of disc-cutter wear in TBM construction: A case study of Chaoer to Xiliao water conveyance tunnel in China von Yang, WenKun, Chen, ZuYu, Wu, GenSheng, Xing, Hai

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A thermal performance assessment of panel type packaging (PTP) technology for high efficiency LED von Yen-Fu Su, Yu-Hsiang Yang, Wen-Kun Yang, Kuo-Ning Chiang

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Reliability Analysis of the Panel Base Package (PBP) Technology with Enhanced Cover Layer von Ming-Chih Yew, Chun-Fai Yu, Mars Tsai, Dyi-Chung Hu, Wen-Kun Yang, Kuo-Ning Chiang

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Investigation of stress-buffer-enhanced package subjected to board-level drop test von Chan-Yen Chou, Tuan-Yu Hung, Ming-Chih Yew, Wen-Kun Yang, Dyi-Chung Hu, Mon-Chin Tsai, Ching-Shun Huang, Kuo-Ning Chiang

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Method for forming semiconductor device package with slanting structures von Yang Wen Kun

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Method for forming LED package von YANG WEN KUN

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Method for Forming Semiconductor Device Package with Slanting Structures von YANG WEN KUN

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LED Package with Slanting Structure and Method of the Same von YANG WEN KUN

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CYP2A6 Polymorphisms Associate with Outcomes of S-1 Plus Oxaliplatin Chemotherapy in Chinese Gastric Cancer Patients von Yang, Lin, Zou, Shanshan, Shu, Chang, Song, Yan, Sun, Yong-Kun, Zhang, Wen, Zhou, Aiping, Yuan, Xinghua, Yang, Yi, Hu, Songnian

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Semiconductor Device Package with Slanting Structures von YANG WEN KUN

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LED Package with Slanting Structure and Method of the Same von YANG WEN KUN

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Semiconductor Device Package with Slanting Structures von YANG WEN KUN

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