ReBISR: A Reconfigurable Built-In Self-Repair Scheme for Random Access Memories in SOCs von TSENG, Tsu-Wei, LI, Jin-Fu, HSU, Chih-Chiang

Volltext

Cost-Efficient Built-In Redundancy Analysis With Optimal Repair Rate for RAMs von Chen, Ting-Ju, Li, Jin-Fu, Tseng, Tsu-Wei

Volltext

A Low-Cost Built-In Redundancy-Analysis Scheme for Word-Oriented RAMs With 2-D Redundancy von TSENG, Tsu-Wei, LI, Jin-Fu

Volltext

Memory Built-in Self-Repair Planning Framework for RAMs in SoCs von Hou, Chih-Sheng, Li, Jin-Fu, Tseng, Tsu-Wei

Volltext

Post Cleaning for FEOL CMP with Silica and Ceria Slurries von Tseng, Wei-Tsu, Wu, Changhong, McCormack, Tim, Yang, Ji Chul

Volltext

ProTaR: An Infrastructure IP for Repairing RAMs in System-on-Chips von Huang, Chao-Da, Li, Jin-Fu, Tseng, Tsu-Wei

Volltext

BEOL Cu CMP Process Evaluation for Advanced Technology Nodes von Tanwar, Kunaljeet, Canaperi, Donald, Lofaro, Michael, Tseng, Wei-tsu, Patlolla, Raghuveer, Penny, Christopher, Waskiewicz, Christopher

Volltext

DABISR: A Defect-Aware Built-In Self-Repair Scheme for Single/Multi-Port RAMs in SoCs von Tseng, Tsu-Wei, Huang, Yu-Jen, Li, Jin-Fu

Volltext

Process Co-Optimization of CVD and CMP for Tungsten Metallization von Pancharatnam, Shanti, Tseng, Wei-Tsu, Choi, Samuel, Johnson, Richard

Volltext

Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology von Wei-Tsu Tseng, Devarapalli, Vamsi, Steffes, James, Ticknor, Adam, Khojasteh, Mahmoud, Poloju, Praneetha, Goyette, Colin, Steber, David, Tai, Leo, Molis, Steven, Zaitz, Mary, Rill, Elliott, Kennett, Michael, Economikos, Laertis, Lustig, Naftali, Bunke, Christine, Truong, Connie, Chudzik, Michael, Grunow, Stephan

Volltext

Reliability-Enhancement and Self-Repair Schemes for SRAMs With Static and Dynamic Faults von Li, Jin-Fu, Tseng, Tsu-Wei, Hou, Chih-Sheng

Volltext

Cobalt "Buff Step" Chemical Mechanical Planarization von Stuffle, Calliandra, Han, Ruochen, Sampurno, Yasa, Theng, Siannie, Tseng, Wei-Tsu, Philipossian, Ara

Volltext

Application of a Slurry Injection System to Cobalt "Buff Step" Chemical Mechanical Planarization von Stuffle, Calliandra, Han, Ruochen, Sampurno, Yasa, Theng, Siannie, Tseng, Wei-Tsu, Philipossian, Ara

Volltext

Re-examination of pressure and speed dependences of removal rate during chemical-mechanical polishing processes von TSENG, W.-T, WANG, Y.-L

Volltext

A Combined Gas Cluster Ion Beam (GCIB) and Chemical-Mechanical Polish (CMP) Planarization Scheme for Tungsten Replacement Metal Gate (W-RMG) von Tseng, Wei-Tsu, Long, Justin, Mohan, Kaushik, Kagalwala, Taher, Wu, Changhong, Truong, Connie

Volltext

Using CMP Model for 45nm/32nm BEOL Process and Design Evaluations von Economikos, Laertis, Bao, Jerry, Low, Kia, Wei-Tsu, Tseng, Matusiewicz, Gerald

Volltext

Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes von Wei-Tsu Tseng, Canaperi, D., Ticknor, A., Devarapalli, V., Tai, L., Economikos, L., MacDougal, J., Bunke, C., Angyal, M., Muncy, J., Xiaomeng Chen, Zhang, J., Qiang Fang, Jianping Zheng

Volltext

Post Cleaning for FEOL CMP with Silica and Ceria Slurries von Tseng, Wei-Tsu, Jha, Amarnath, Stoll, Derek, Wu, Changhong, McCormack, Tim, Yang, JI Chul

Volltext

A comparative study on the roles of velocity in the material removal rate during chemical mechanical polishing von TSENG, W.-T, CHIN, J.-H, KANG, L.-C

Volltext

A Microreplicated Pad for Tungsten Chemical-Mechanical Planarization von Tseng, Wei-Tsu, Mohan, Kaushik, Hull, Ricky, Hagan, James, Truong, Connie, Lehuu, Duy K., Muradian, David

Volltext