The relationship between midlife dyslipidemia and lifetime incidence of dementia: A systematic review and meta‐analysis of cohort studies von Wee, Jason, Sukudom, Sara, Bhat, Saiuj, Marklund, Matti, Peiris, Niridu Jude, Hoyos, Camilla M, Patel, Sanjay, Naismith, Sharon L, Dwivedi, Girish, Misra, Ashish

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Interleukin-8 Induction by Burkholderia pseudomallei Can Occur without Toll-Like Receptor Signaling but Requires a Functional Type III Secretion System von Hii, Chung-Shii, Sun, Guang Wen, Goh, Jason Wee Kang, Lu, Jinhua, Stevens, Mark P., Gan, Yunn-Hwen

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Hepatic Steatosis and High-Risk Coronary Plaque von Sukudom, Sara, Wee, Jason, Huangfu, Gavin, Ayonrinde, Oyekoya, Fegan, P. Gerry, Ihdayhid, Abdul, Watts, Gerald F., Dwivedi, Girish

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Hepatic Steatosis and High-Risk Coronary Plaque: A Systematic Review von Sukudom, Sara, Wee, Jason, Huangfu, Gavin, Ayonrinde, Oyekoya, Fegan, P. Gerry, Ihdayhid, Abdul, Watts, Gerald F., Dwivedi, Girish

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Liver rheumatoid nodules imitating liver malignancy: a rare occurrence von Wee, Jason, Sobhi, Salar, De Boer, Bastiaan, Xu, Dan

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Crossed-dipole arrays for asynchronous DS-CDMA systems von Manikas, A., Ng, J.W.P.

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Method and system for measuring direction of arrival of wireless signal using circular array displacement von Kulaib, Ahmed Rashed, Al-Qutayri, Mahmoud A, Ng, Jason Wee Peng, Shubair, Raed M

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MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX CURVED SURFACE ATTACHED TO A SEMICONDUCTOR DIE von Mohamed, Nor Haqimi, Lim, Wee Aun Jason, Gabrillo, Marie Hazel Barozzo, Lee, Chai Chee

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Topside-cooled semiconductor package with molded standoff von Chong, Chee Chiew, Lim, Wee Aun Jason, Chen, Liu, Tay, Wee Boon, Myers, Edward

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MONITORING MOVEMENT von BOWMAN, PAUL, ADRIAN, NG, JASON, WEE PENG

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TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF von MYERS, Edward, CHONG, Chee Chiew, TAY, Wee Boon, LIM, Wee Aun Jason, CHEN, Liu

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SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE von Loh, Ai Yun, Abdul Rani, Badrus Hisham, Jason Lim, Wee Aun, Low, Hwee Yin, Wahid, Muhamad Hairul Fauzi

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SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE von WAHID, Muhamad Hairul Fauzi, LOH, Ai Yun, ABDUL RANI, Badrus Hisham, LIM, Wee Aun Jason, LOW, Hwee Yin

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Three cities and a dream: Jason Wee von Jason Wee

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MONITORING MOVEMENT von BOWMAN, PAUL, ADRIAN, NG, JASON, WEE PENG

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SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR CHIP, AND METHOD OF FORMING A CHIP SYSTEM von JASON LIM, Wee Aun, DINKEL, Markus, ZHUANG, Hao, BLANK, Oliver, Schlögel, Xaver, TEOH, Hooi Boon, CALO, Paul Armand, Nöbauer, Gerhard Thomas, Pölzl, Martin, TAN, Chee Voon, SAM, Ying Pok, Höglauer, Josef, OTREMBA, Ralf, Hölzl, Daniel

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MONITORING MOVEMENT von BOWMAN, PAUL, ADRIAN, NG, JASON, WEE PENG

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Power semiconductor package and method for fabricating a power semiconductor package von Sam, Ying Pok, Lim, Wee Aun Jason, Chin, Ting Soon, Chong, Chooi Mei, Calo, Paul Armand Asentista, Murugan, Sanjay Kumar, Tan, Chee Voon

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REMOTE MONITORING THRESHOLDS von MIZUTANI, TOM, NG, JASON, WEE PENG

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MONITORING DEVICE FOR MONITORING PHYSICAL VARIABLES von BOWMAN, PAUL, ADRIAN, NG, JASON, WEE, PENG

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