A High-Performance Single-Photon Avalanche Diode in 130-nm CMOS Imaging Technology von Webster, E. A. G., Grant, L. A., Henderson, R. K.

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Scaleable Single-Photon Avalanche Diode Structures in Nanometer CMOS Technology von Richardson, J A, Webster, E A G, Grant, L A, Henderson, R K

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Theoretical and numerical modelling of creep crack growth in a carbon–manganese steel von Yatomi, M., O’Dowd, N.P., Nikbin, K.M., Webster, G.A.

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Residual stress distributions and their influence on fatigue lifetimes von Webster, G.A., Ezeilo, A.N.

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Assessment of creep crack growth due to stress relief von Webster, G.A., Davies, C.M., Nikbin, K.M.

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Per-Pixel Dark Current Spectroscopy Measurement and Analysis in CMOS Image Sensors von Webster, E A G, Nicol, R L, Grant, L, Renshaw, D

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A Single-Photon Avalanche Diode in 90-nm CMOS Imaging Technology With 44% Photon Detection Efficiency at 690 nm von Webster, E. A. G., Richardson, J. A., Grant, L. A., Renshaw, D., Henderson, R. K.

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Fracture mechanics analysis of a crack in a residual stress field von LEI, Y, O'DOWD, N. P, WEBSTER, G. A

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A Code of Practice for conducting notched bar creep tests and for interpreting the data von WEBSTER, G. A., HOLDSWORTH, S. R., LOVEDAY, M. S., NIKBIN, K., PERRIN, I. J., PURPER, H., SKELTON, R. P., SPINDLER, M. W.

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Extensometer probe indentation during low-cycle fatigue of plain and circumferentially notched cylindrical bars at 550 °C von Skelton, R.P., Webster, G.A.

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Influence of reference stress formulae on creep and creep-fatigue crack initiation and growth prediction in plate components von Wasmer, K., Nikbin, K.M., Webster, G.A.

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Transient Single-Photon Avalanche Diode Operation, Minority Carrier Effects, and Bipolar Latch Up von Webster, E. A. G., Grant, L. A., Henderson, R. K.

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Energy criteria and cumulative damage during fatigue crack growth von Skelton, R.P., Vilhelmsen, T., Webster, G.A.

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Comparison of creep crack initiation and growth in four steels tested in HIDA von Tan, M, Celard, N.J.C, Nikbin, K.M, Webster, G.A

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A Dual-Junction Single-Photon Avalanche Diode in 130-nm CMOS Technology von Henderson, R. K., Webster, E. A. G., Grant, L. A.

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Theoretical determination of reference stress for partially penetrating flaws in plates von Goodall, I.W., Webster, G.A.

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Transcriptional Cross Talk between NF-κB and p53 von Webster, Gill A., Perkins, Neil D.

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Measurement of residual stresses in T-plate weldments von Wimpory, R. C, May, P. S, O'Dowd, N. P, Webster, G. A, Smith, D J, Kingston, E

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Finite element analysis of notched bar skeletal point stresses and dimension changes due to creep von WEBSTER, G. A., NIKBIN, K. M., BIGLARI, F.

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Axial and Diametral Cyclic Stress—Strain Response in Plain and Circumferentially Notched Cylindrical Bars at 550 °C von Skelton, R. P, Webster, G. A

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