Performance of an image adjustment device for SCALPEL von Waskiewicz, W.K.

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INTERFACE IMPERFECTIONS IN METAL/SI MULTILAYERS von WINDT, DL, HULL, R, WASKIEWICZ, WK

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Surface finish requirements for soft x-ray mirrors von Windt, D L, Waskiewicz, W K, Griffith, J E

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Monte Carlo study of high performance resists for SCALPEL nanolithography von Ocola, L.E., Li, W-Y., Kasica, R.J., Blakey, M.I., Orphanos, P.A., Waskiewicz, W.K., Novembre, A.E., Sato, M.

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Variation in stress with background pressure in sputtered Mo/Si multilayer films von Windt, D. L., Brown, W. L., Volkert, C. A., Waskiewicz, W. K.

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Global space charge effect in SCALPEL von Mkrtchyan, M., Munro, E., Liddle, J.A., Stanton, S.T., Waskiewicz, W.K., Farrow, R.C., Katsap, V.

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Marks for SCALPEL ® tool optics optimization von Farrow, R.C., Gallatin, G.M., Waskiewicz, W.K., Liddle, J.A., Kizilyalli, I., Kornblit, A., Biddick, C., Blakey, M., Klemens, F., Felker, J., Kraus, J., Mkrtchyan, M., Orphanos, P.A., Layadi, N., Merchant, S.

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Diffraction-limited soft-x-ray projection imaging using a laser plasma source von TICHENOR, D. A, KUBIAK, G. D, TENNANT, D. M, BJORKHOLM, J. E, MACDOWELL, A. A, BOKOR, J, JEWELL, T. E, WHITE, D. L, WINDT, D. L, WASKIEWICZ, W. K, MALINOWSKI, M. E, STULEN, R. H, HANEY, S. J, BERGER, K. W, BROWN, L. A, FREEMAN, R. R, MANSFIELD, W. M, WOOD, O. R

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An object pattern post-processor for validation of electron optical modelling von Munro, E., Zhu, X., Liu, H., Rouse, J.A., Waskiewicz, W.K.

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STRESS-RELAXATION IN MO/SI MULTILAYER STRUCTURES von KOLA, RR, WINDT, DL, WASKIEWICZ, WK, WEIR, BE, HULL, R, CELLER, GK, VOLKERT, CA

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Optimization of a SCALPEL ® exposure tool using a diffractive image quality technique von Eichner, L., Blakey, M.I., Farrow, R.C., Liddle, J.A., Orphanos, P.A., Waskiewicz, W.K.

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Analysis of a SCALPEL™ multi-pass writing strategy von Zhu, X., Munro, E., Rouse, J.A., Liu, H., Waskiewicz, W.K.

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Mask technologies for soft-x-ray projection lithography at 13 nm von Tennant, D M, Fetter, L A, Harriott, L R, Macdowell, A A, Mulgrew, P P, Pastalan, J Z, Waskiewicz, W K, Windt, D L, Wood Ii, O R

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Ordering at Si(111)/a-Si and Si(111)/SiO2 interfaces von ROBINSON, I. K, WASKIEWICZ, W. K, TUNG, R. T, BOHR, J

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CMOS compatible alignment marks for the SCALPEL proof of lithography tool von Farrow, R.C., Waskiewicz, W.K., Kizilyalli, I., Ocola, L., Felker, J., Biddick, C., Gallatin, G., Mkrtchyan, M., Blakey, M., Kraus, J., Novembre, A., Orphanos, P., Peabody, M., Kasica, R., Kornblit, A., Klemens, F.

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Electron-optics method for high-throughput in a SCALPEL system: Preliminary analysis von Waskiewicz, W.K., Harriott, L.R., Liddle, J.A., Stanton, S.T., Berger, S.D., Munro, E., Zhu, X.

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Space-charge limitations to throughput in projection electron-beam lithography (SCALPEL) von Liddle, J.A., Blakey, M.I., Knurek, C.S., Mkrtchyan, M.M., Novembre, A.E., Ocola, L., Saunders, T., Waskiewicz, W.K.

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Use of trilevel resists for high-resolution soft-x-ray projection lithography von BERREMAN, D. W, BJORKHOLM, J. E, SILFVAST, W. T, SZETO, L. H, TENNANT, D. M, WASKIEWICZ, W. K, WHITE, D. L, WINDT, D. L, WOOD, O. R, BECKER, M, EICHNER, L, FREEMAN, R. R, JEWELL, T. E, MANSFIELD, W. M, MACDOWELL, A. A, O'MALLEY, M. L, RAAB, E. L

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Soft-x-ray projection lithography experiments using Schwarzschild imaging optics von Tichenor, D A, Kubiak, G D, Malinowski, M E, Stulen, R H, Haney, S J, Berger, K W, Brown, L A, Sweatt, W C, Bjorkholm, J E, Freeman, R R, Himel, M D, Macdowell, A A, Tennant, D M, Wood, R, Bokor, J, Jewell, T E, Mansfield, W M, Waskiewicz, W K, White, D L, Windt, D L

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Soft-x-ray projection imaging with a 1:1 ring-field optic von Macdowell, A A, Bjorkholm, J E, Early, K, Freeman, R R, Himel, M D, Mulgrew, P P, Szeto, L H, Taylor, D W, Tennant, D M, Wood Ii, O R, Bokor, J, Eichner, L, Jewell, T E, Waskiewicz, W K, White, D L, Windt, D L, D'Souza, R M, Silfvast, W T, Zernike, F

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