Deformation anisotropy of nano-scratching on C-plane of sapphire: A molecular dynamics study and experiment von Lin, Jiaming, Jiang, Feng, Wen, Qiuling, Wu, Yueqin, Lu, Jing, Tian, Zige, Wang, Ningchang

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Particle gradations optimization for powder spreading in additive manufacturing von Zhang, Jiangtao, Wang, Ningchang, Chen, Xing, Tan, Yuanqiang

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Study on mechanism of crack propagation of sapphire single crystals of four different orientations under impact load and static load von Wang, Ke, Jiang, Feng, Yan, Lan, Xu, Xipeng, Wang, Ningchang, Zha, Xuming, Lu, Xizhao, Wen, Qiuling

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Effects of Crystal Orientation on the Crack Propagation of Sapphire by Sequential Indentation Testing von Wang, Ningchang, Jiang, Feng, Xu, Xipeng, Lu, Xizhao

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Fracture Behavior of Single-Crystal Sapphire in Different Crystal Orientations von Huang, Shizhan, Lin, Jiaming, Wang, Ningchang, Guo, Bicheng, Jiang, Feng, Wen, Qiuling, Lu, Xizhao

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Atomistic understanding of the variable nano-hardness of C-plane sapphire considering the crystal anisotropy von Qiu, Tian, Jiang, Feng, Wang, Ningchang, Lin, Jiaming, Tian, Zige, Wu, Yueqin, Wen, Qiuling, Lu, Jing

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Experimental Study on the Grinding of an Fe-Cr-Co Permanent Magnet Alloy under a Small Cutting Depth von Wang, Ningchang, Jiang, Feng, Zhu, Jianhui, Xu, Yuchun, Shi, Chaoyu, Yan, Heliang, Gu, Chunqing

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Grain size dependence of modified material constitutive model for OFHC copper von Zhang, Tao, Yan, Lan, Li, Lianjie, Huo, Mingshuai, Wu, Hui, Zha, Xuming, Wang, Ningchang, Wu, Xian, Jiang, Feng, Jiang, Zhengyi, Xu, Xipeng

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Effect of dislocation defects on the nano-scratching process of 4H–SiC von Wang, Yixiang, Ding, Haiyang, Wang, Ningchang, Huang, Yuxiang, Yu, Yiqing, Huang, Hui, Duan, Nian

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Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal von Ban, Xinxing, Zhu, Jianhui, Sun, Guannan, Han, Shaoxing, Duan, Tianxu, Wang, Ningchang

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Research on the dynamic mechanical properties of C-plane sapphire under impact loading von Jiang, Feng, Luan, Xiaosheng, Wang, Ningchang, Xu, Xipeng, Lu, Xizhao, Wen, Qiuling

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The mechanical response characteristics of sapphire under dynamic and quasi-static indentation loading von Luan, Xiaosheng, Jiang, Feng, Wang, Ningchang, Xu, Xipeng, Lu, Xizhao, Wen, Qiuling

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Scratching properties of 4H–SiC single crystal after oxidation under different conditions von Ban, Xinxing, Tian, Zhuangzhi, Zheng, Shaodong, Zhu, Jianhui, Ba, Wenlan, Wang, Ningchang, Han, Shaoxing, Qiu, Hui, Wang, Xing, Li, Zhengxin

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Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions von Wang, Ningchang, Jiang, Feng, Xu, Xipeng, Duan, Nian, Wen, Qiuling, Lu, Xizhao

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Microscopic removal mechanism of 4 H-SiC during abrasive scratching in aqueous H2O2 and H2O: Insights from ReaxFF molecular dynamics von Ban, Xinxing, Zheng, Shaodong, Tian, Zhuangzhi, Zhu, Jianhui, Ba, Wenlan, Wang, Ningchang, Han, Shaoxing, Qiu, Hui, Wang, Xing, Li, Zhengxin

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Investigation of the Anisotropy of 4H-SiC Materials in Nanoindentation and Scratch Experiments von Shi, Suhua, Yu, Yiqing, Wang, Ningchang, Zhang, Yong, Shi, Weibin, Liao, Xinjiang, Duan, Nian

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Compound mechanical and chemical-mechanical polishing processing technique for single-crystal silicon carbide von Ban, Xinxing, Tian, Zhuangzhi, Zhu, Jianhui, Duan, Tianxu, Zheng, Shaodong, Wang, Ningchang, Han, Shaoxing, Qiu, Hui, Li, Zhengxin

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Process optimization of 4H-SiC chemical mechanical polishing based on grey relational analysis von Ban, Xinxing, Duan, Tianxu, Tian, Zhuangzhi, Li, Yunhe, Zhu, Jianhui, Wang, Ningchang, Han, Shaoxing, Qiu, Hui, Li, Zhengxin

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Research on the analytical modeling of critical conditions of serrated Chip formation based on thermal-mechanical coupled material behavior von Guo, Bicheng, Jiang, Feng, Yan, Lan, Wang, Ningchang, Huang, Hui, Wang, Fuzeng, Xie, Hong

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Prediction of pop-in load for sapphires with different crystal orientations von Wang, Ke, Jiang, Feng, Li, Yaning, Wang, Ningchang, Hu, Zhongwei, Yan, Lan, Lu, Jing, Wen, Qiuling, Lu, Xizhao

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