Treffer 1 - 20 von 71 für Suche 'Wakharkar, Vijay', Suchdauer: 0,60s Treffer weiter einschränken
  1. 1
    WATERPROOF MEMS PRESSURE SENSOR PACKAGE WITH A METAL LID AND AN EMBEDDED ePTFE FILTER AND PROCESS OF MAKING

    WATERPROOF MEMS PRESSURE SENSOR PACKAGE WITH A METAL LID AND AN EMBEDDED ePTFE FILTER AND PROCESS OF MAKING von BRIOSCHI, Roberto, SHARMA, Monisha, WAKHARKAR, Vijay

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  2. 2
    Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Embedded ePTFE Filter And Process Of Making

    Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Embedded ePTFE Filter And Process Of Making von Wakharkar, Vijay, Sharma, Monisha, Brioschi, Roberto

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  3. 3
    Critical Aspects of High-Performance Microprocessor Packaging

    Critical Aspects of High-Performance Microprocessor Packaging von Atluri, Vasudeva P., Mahajan, Ravi V., Patel, Priyavadan R., Mallik, Debendra, Tang, John, Wakharkar, Vijay S., Chrysler, Gregory M., Chiu, Chia-Pin, Choksi, Gaurang N., Viswanath, Ram S.

    Veröffentlicht in MRS bulletin

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  4. 4
    Waterproof MEMS pressure sensor package with a metal lid and an embedded ePTFE filter and process of making

    Waterproof MEMS pressure sensor package with a metal lid and an embedded ePTFE filter and process of making von SHARMA, MONISHA, WAKHARKAR, VIJAY, BRIOSCHI, ROBERTO

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  5. 5
    Materials Technologies for Thermomechanical Management of Organic Packages

    Materials Technologies for Thermomechanical Management of Organic Packages von Wakharkar, Vijay

    Veröffentlicht in Intel technology journal

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  6. 6
    LIQUID PROOF PRESSURE SENSOR

    LIQUID PROOF PRESSURE SENSOR von SHARMA-KULAMARVA, Manish, SCHMIDT, Matthias, MICLAUS, Calin, VUJOSEVIC, Milena, WAKHARKAR, Vijay

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  7. 7
    Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes

    Electronic Packages and Components Thereof Formed by Co-Deposited Carbon Nanotubes von WAKHARKAR VIJAY S, RARAVIKAR NACHIKET R

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  8. 8
    Electronic packages and components thereof formed by co-deposited carbon nanotubes

    Electronic packages and components thereof formed by co-deposited carbon nanotubes von WAKHARKAR VIJAY, RARAVIKAR NACHIKET

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  9. 9
    Flip-chip system and method of making same

    Flip-chip system and method of making same von JAYARAMAN SAIKUMAR,WAKHARKAR VIJAY

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  10. 10
    Electronic packages with fine particle wetting and non-wetting zones

    Electronic packages with fine particle wetting and non-wetting zones von MATAYABAS CHRIS, CHAKRAPANI NIRUPAMA, WAKHARKAR VIJAY S

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  11. 11
    Electronic packages with fine particle wetting and non-wetting zones

    Electronic packages with fine particle wetting and non-wetting zones von Chakrapani, Nirupama, Wakharkar, Vijay S, Matayabas, Chris

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  12. 12
    Electronic Packages With Fine Particle Wetting and Non-Wetting Zones

    Electronic Packages With Fine Particle Wetting and Non-Wetting Zones von MATAYABAS CHRIS, CHAKRAPANI NIRUPAMA, WAKHARKAR VIJAY S

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  13. 13
    Electronic packages with fine particle wetting and non-wetting zones

    Electronic packages with fine particle wetting and non-wetting zones von MATAYABAS CHRIS, CHAKRAPANI NIRUPAMA, WAKHARKAR VIJAY S

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  14. 14
    Electronic packages with fine particle wetting and non-wetting zones

    Electronic packages with fine particle wetting and non-wetting zones von Chakrapani, Nirupama, Wakharkar, Vijay S, Matayabas, Chris

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  15. 15
    FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME

    FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME von JAYARAMAN, SAIKUMAR, WAKHARKAR, VIJAY

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  16. 16
    FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME

    FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME von JAYARAMAN, SAIKUMAR, WAKHARKAR, VIJAY

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  17. 17
    Modular device assemblies

    Modular device assemblies von Wakharkar, Vijay, Sterrett, Terry

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  18. 18
    Flip-chip system and method of making same

    Flip-chip system and method of making same von Wakharkar, Vijay, Jayaraman, Saikumar

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  19. 19
    Electronic Packages with Fine Particle Wetting and Non-Wetting Zones

    Electronic Packages with Fine Particle Wetting and Non-Wetting Zones von MATAYABAS CHRIS, CHAKRAPANI NIRUPAMA, WAKHARKAR VIJAY S

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  20. 20
    FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME

    FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME von VIJAY WAKHARKAR, SAIKUMAR JAYARAMAN

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