Interfacial Stability in Bi2Te3 Thermoelectric Joints von Wang, Chun-Hsien, Hsieh, Hsien-Chien, Sun, Zhen-Wei, Ranganayakulu, V K, Lan, Tian-Wey, Chen, Yang-Yuan, Chang, Ying-Yi, Wu, Albert T

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Hybrid Solder Joint for Low-Temperature Bonding Application von Lai, Yu-Yuan, Chao, Jui-Lin, Hsu, Chia-Jung, Wang, Chang-Meng, Wu, Albert T.

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Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits von Huang, Y. T., Hsu, H. H., Wu, Albert T.

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Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits von Hsu, H. H., Huang, Y. T., Huang, S. Y., Chang, T. C., Wu, Albert T.

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High dislocation density of tin induced by electric current von Liao, Yi-Han, Liang, Chien-Lung, Lin, Kwang-Lung, Wu, Albert T.

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Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature von Huang, Kuo-Shuo, Shen, Tzu-Hao, Liu, Wei, Chao, Jui-Lin, Wu, Albert T.

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Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish von Zhang, Zheng, Chen, Chuantong, Wu, Albert T., Suganuma, Katsuaki

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Corrosion on automobile printed circuit broad von Tseng, Tsan-Hsien, Wu, Albert T.

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Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material von Wang, Chun-Hsien, Hsieh, Hsien-Chien, Lee, Hsin-Yi, Wu, Albert T.

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Electroless Co-P diffusion barrier for n-PbTe thermoelectric material von Hsieh, Hsien-Chien, Wang, Chun-Hsien, Lin, Wen-Chih, Chakroborty, Subhendu, Lee, Tse-Hsiao, Chu, Hsu-Shen, Wu, Albert T.

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Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules von Lin, Wen-Chih, Li, Ying-Sih, Wu, Albert T.

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Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes von Chen, Hao, Tsai, Yi-Ling, Chang, Yu-Ting, Wu, Albert T.

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Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier von Hsieh, Hsien-Chien, Wang, Chun-Hsien, Lan, Tian-Wey, Lee, Tse-Hsiao, Chen, Yang-Yuan, Chu, Hsu-Shen, Wu, Albert T.

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Disruption of crystalline structure of Sn3.5Ag induced by electric current von Huang, Han-Chie, Lin, Kwang-Lung, Wu, Albert T.

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The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing von He, Jian-Yang, Lin, Kwang-Lung, Wu, Albert T.

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Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding von Lin, Po Chen, Chen, Hao, Hsieh, Hsien-Chien, Tseng, Tsan-Hsien, Lee, Hsin Yi, Wu, Albert T.

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Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures von Chen, Hao, Lee, Hsin Yi, Ku, Ching Shun, Wu, Albert T

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Analysis of Chlorine Ions in Antimony-Doped Tin Oxide Thin Film Using Synchrotron Grazing Incidence X-ray Diffraction von Lin, Yang-Yi, Wu, Albert T, Ku, Ching-Shun, Lee, Hsin-Yi

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Interfacial Stability in Bi 2 Te 3 Thermoelectric Joints von Wang, Chun-Hsien, Hsieh, Hsien-Chien, Sun, Zhen-Wei, Ranganayakulu, V K, Lan, Tian-Wey, Chen, Yang-Yuan, Chang, Ying-Yi, Wu, Albert T

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Crystallographic Orientation Effect on Electromigration in Ni-Sn Microbump von Huang, Yi-Ting, Chen, Chih-Hao, Chakroborty, Subhendu, Wu, Albert T.

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