Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling von Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee, Daniel

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Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application von Chidambaram, Vivek, Bangtao, Chen, Lip, Gan Chee, Rhee Min Woo, Daniel

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Cyanate Ester-Based Encapsulation Material for High-Temperature Applications von Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo

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Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate von Lim, Ju Dy, Lee, Pui Mun, Rhee, Daniel Min Woo, Leong, Kam Chew, Chen, Zhong

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Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices von Gongyue Tang, Yong Han, Boon Long Lau, Xiaowu Zhang, Rhee, Daniel Min Woo

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Numerical Analysis of Narrow-gap Underfill Flow in the Flip-chip Process Using the Lattice Boltzmann Method von Lee, Jung Shin, Kang, Sujie, Rhee, Daniel Min Woo

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Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages von Hoe, Yen Yi Germaine, Yap Guan Jie, Rao, V. S., Rhee, M. W. Daniel

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Process characterization of highly conductive silver paste die attach materials for thin die on QFN von Leong Ching Wai, Ding Mian Zhi, Rao, V. S., Rhee, Min Woo Daniel

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Flow modeling of die attach process and the optimization of process parameters in advance packaging von Lin Ji, Leong Ching Wai, Rhee, M. W. D.

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Impact of advanced materials on power cycling performance and process dependent stresses of QFN von Ho Siow Ling, Ching, E. W. L., Yi, G. H. Y., Rhee, Min Woo Daniel

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Characterization of thermally conductive underfill materials for high performance flip-chip applications von Chew, M., Mian Zhi Ding, Wai, E., Ser Choong Chong, Rao, V. S., Rhee, Min Woo Daniel

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CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT von Daniel Rhee Min Woo, HWANG How Yuan, CHIDAMBARAM Vivek, CHAN Yuen Sing, Eva WAI Leong Ching, LEE Jong Bum

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Chemical sensor package for highly pressured environment von Chan Yuen Sing, Lee Jong Bum, Chidambaram Vivek, Woo Daniel Rhee Min, Hwang How Yuan, Wai Eva Leong Ching

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High-temperature endurable encapsulation material von Chidambaram, V., Ho Beng Yeung, Chan Yuen Sing, Woo, D. R. M.

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CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT von Chan Yuen Sing, Lee Jong Bum, Chidambaram Vivek, Woo Daniel Rhee Min, Hwang How Yuan, Wai Eva Leong Ching

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Chemical sensor package for highly pressured environment von Chan Yuen Sing, Lee Jong Bum, Chidambaram Vivek, Woo Daniel Rhee Min, Hwang How Yuan, Wai Eva Leong Ching

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Chemical Sensor Package For Highly Pressured Environment von DANIEL RHEE MIN WOO, LEE JONG BUM, EVA WAI LEONG CHING, CHAN YUEN SING, CHIDAMBARAM VIVEK, HWANG HOW YUAN

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CHEMICAL SENSOR PACKAGE FOR HIGHLY PRESSURED ENVIRONMENT von LEE JONG BUM, CHAN YUEN SING, CHIDAMBARAM VIVEK, WAI EVA LEONG CHING, WOO DANIEL RHEE MIN, HWANG HOW YUAN

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Circularly polarized light-sensitive, hot electron transistor with chiral plasmonic nanoparticles von Namgung, Seok Daniel, Kim, Ryeong Myeong, Lim, Yae-Chan, Lee, Jong Woo, Cho, Nam Heon, Kim, Hyeohn, Huh, Jin-Suk, Rhee, Hanju, Nah, Sanghee, Song, Min-Kyu, Kwon, Jang-Yeon, Nam, Ki Tae

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Circulating tumor DNA as a prognostic indicator in resectable pancreatic ductal adenocarcinoma: A systematic review and meta-analysis von Lee, Jee-Soo, Rhee, Tae-Min, Pietrasz, Daniel, Bachet, Jean-Baptiste, Laurent-Puig, Pierre, Kong, Sun-Young, Takai, Erina, Yachida, Shinichi, Shibata, Tatsuhiro, Lee, Jung Woo, Park, Hyoung-chul, Zang, Dae Young, Jeon, Kibum, Lee, Jiwon, Kim, Miyoung, Kim, Han-Sung, Kang, Hee Jung, Lee, Young Kyung

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