The challenges of accurate waist and hip measurement over clothing: Pilot data von Wills, S.D, Bhopal, R.S

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The heterogeneous integration of optical interconnections into integrated microsystems von Jokerst, N.M., Brooke, M.A., Sang-Yeon Cho, Wilkinson, S., Vrazel, M., Fike, S., Tabler, J., Yoong Joon Joo, Sang-Woo Seo, Wills, D.S., Brown, A.

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Portable video supercomputing von Gentile, A., Wills, D.S.

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On-chip decoupling capacitor optimization using architectural level prediction von Pant, M.D., Pant, P., Wills, D.S.

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Parallelized formulation of the maximum likelihood-expectation maximization algorithm for fine-grain message-passing architectures von Cruz-Rivera, J.L., Di Bella, E.V.R., Wills, S., Gaylord, T.K., Glytsis, E.N.

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Scaling up the Atlas chip-multiprocessor von Sassone, P.G., Wills, D.S.

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Architecture of the Atlas chip-multiprocessor: dynamically parallelizing irregular applications von Codrescu, L., Wills, D.S., Meindl, J.

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Systolic opportunities for multidimensional data streams von Chai, S.M., Wills, D.S.

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Modeling technology impact on cluster microprocessor performance von Codrescu, L., Nugent, S., Meindl, J., Wills, D.S.

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Focal-plane processing architectures for real-time hyperspectral image processing von Chai, S M, Gentile, A, Lugo-Beauchamp, W E, Fonseca, J, Cruz-Rivera, J L, Wills, D S

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Heterogeneous architecture models for interconnect-motivated system design von Sek Meng Chai, Taha, T.M., Wills, D.S., Meindl, J.D.

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Microsystem optoelectronic integration for mixed multisignal systems von Jokerst, N.M., Brooke, M.A., Laskar, J., Wills, D.S., Brown, A.S., Vrazel, M., Jung, S., Joo, Y., Chang, J.J.

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HiPER: a compact narrow channel router with hop-by-hop error correction von May, P., Bunchua, S., Wills, D.S.

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The Data Vortex, an All Optical Path Multicomputer Interconnection Network von Hawkins, C., Small, B.A., Wills, D.S., Bergman, K.

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The offset cube: a three-dimensional multicomputer network topology using through-wafer optics von Lacy, W.S., Cruz-Rivera, J.L., Wills, D.S.

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A three-dimensional high-throughput architecture using through-wafer optical interconnect von Wills, D.S., Lacy, W.S., Camperi-Ginestet, C., Buchanan, B., Cat, H.H., Wilkinson, S., Lee, M., Jokerst, N.M., Brooke, M.A.

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Optimal usage of available wiring resources in diffractive-reflective optoelectronic multichip modules von Cruz-Rivera, J L, Wills, D S, Gaylord, T K, Glytsis, E N

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Processing architectures for smart pixel systems von Wills, D.S., Lacy, W.S., Lopez-Lagunas, A., May, P., Smith, S., Taha, T., Baker, J.M., Cat, H.H., Chai, S.M., Codrescu, L., Cruz-Rivera, J., Eble, J.C., Gentile, A., Hopper, M.A.

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Improvement in bit-error rate for optoelectronic multicomputer interconnection networks using cyclic redundancy code error detection von May, P., Cross, J., Lopez-Lagunas, A., Buchanan, B., Wills, D.S., Jokerst, N.M., Brooke, M.

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High-throughput, low-memory applications on the Pica architecture von Wills, D.S., Cat, H.H., Cruz-Rivera, J., Lacy, W.S., Baker, J.M., Eble, J.C., Lopez-Lagunas, A., Hopper, M.

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