30 Years of Sensors’ Assembly and Packaging 1988 to 2018 von Wilde, Juergen

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The variation in Anand model parameters – How does that affect the bond's response? A comparative study considering sintered Ag bonds von Gharaibeh, Mohammad A., Wilde, Jürgen

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Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds von Gharaibeh, Mohammad A., Wilde, Jürgen

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Research on the creep response of lead-free die attachments in power electronics von Gharaibeh, Mohammad A., Wilde, Jürgen

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Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices von Bajwa, Adeel Ahmad, Wilde, Jürgen

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The influence of strain hardening of copper on the crack path in Cu/Al2O3/Cu direct bonded copper substrates von Gaiser, Patrick, Klingler, Markus, Wilde, Jürgen

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Bottom-Up SAW Resonator Design for Single-Stage Glass Frit Bonding at Chip-Level von Pfeifer, Fabian, Bronner, Andreas, Seiferling, Felix, Wilde, Jurgen

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Influence of Bath Hydrodynamics on the Micromechanical Properties of Electrodeposited Nickel-Cobalt Alloys von Khazi, Isman, Mescheder, Ulrich, Wilde, Juergen

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A novel online 4-point rainflow counting algorithm for power electronics von Obermayr, Martin, Riess, Christian, Wilde, Jürgen

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In situ analysis of electrochemical deposition kinetics for nanocrystalline nickel-cobalt alloys with varying bath hydrodynamics von Khazi, Isman, Wilde, Jürgen, Neusser, Gregor, Kranz, Christine, Mescheder, Ulrich

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Bayesian calibration of ball grid array lifetime models for solder fatigue von Tauscher, Markus, Lämmle, Sven, Roos, Dirk, Wilde, Jürgen

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Numerical characterizations of the thermomechanical response of power modules with ceramic substrates and lead-free bonds von Gharaibeh, Mohammad A., Wilde, Jürgen

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Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component von Tauscher, Markus, Merk, Tobias, Adsule, Aniket, Linnemann, Andreas, Wilde, Jürgen

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Numerical Evaluation of Sintered Silver Die Attachments Based on Different Material Parameters and Creep Constitutive Models von Gharaibeh, Mohammad A., Wilde, Jurgen

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Electronic module assembly von Franke, Jörg, Wang, Lihui, Bock, Karlheinz, Wilde, Jürgen

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Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching von Gaiser, Patrick, Klingler, Markus, Wilde, Jürgen

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Effect of microstructural evolution during dry sliding on the corrosion behaviour of martensitic stainless steel von Gassner, Andreas, Palkowski, Heinz, Müller, Claas, Wilde, Jürgen, Mozaffari-Jovein, Hadi

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Self-assembly of microsystem components with micrometer gluing pads through capillary forces von Samyn, Pieter, Biesalski, Markus, Dalin, Johan, Wilde, Jürgen, Prucker, Oswald, Rühe, Jürgen

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Microstructural and electrical properties of different-sized aluminum-alloyed contacts and their layer system on silicon surfaces von KRAUSE, Jonas, WOEHL, Robert, RAUER, Michael, SCHMIGA, Christian, WILDE, Jürgen, BIRO, Daniel

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Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices von Bajwa, Adeel Ahmad, Yangyang Qin, Reiner, Richard, Quay, Rudiger, Wilde, Jurgen

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