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  1. 1
    SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING

    SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING von BRUN, Xavier F, WIDODO, Trianggono

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  2. 2
    METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

    METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES von Zawadzki, Keith Edward, Deshpande, Nitin Ashok, Arakere, Guruprasad, Kabir, Mohammad Enamul, Karhade, Omkar Gopalkrishna, Krishnatreya, Bhaskar Jyoti, Widodo, Trianggono S

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  3. 3
    PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING

    PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING von DAS, Adita, KARHADE, Omkar G, KRISHNATREYA, Bhaskar Jyoti, BRUN, Xavier Francois, JUN, Kimin, MATTHIESEN, John Edward Zeug, WIDODO, Trianggono, BHATIA, Mohit, KILAMBI, Harini, ELSHERBINI, Adel A, SURAPANENI, Rajesh, ANTARTIS, Dimitrios

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