Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor von Hamid, Youssef, Hutt, David A, Whalley, David C, Craddock, Russell

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Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells von Kyranaki, Nikoleta, Smith, Alex, Yendall, Keith, Hutt, David A., Whalley, David C., Gottschalg, Ralph, Betts, Thomas R.

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The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives von Wang, Shanda, Zhou, Zhaoxia, Goulas, Athanasios, Critchlow, Gary W., Whalley, David C., Hutt, David A.

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A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching von Zhang, Yan, Liu, Changqing, Whalley, David C

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Finite element analysis of lead-free surface mount devices von Hegde, Pradeep, Ochana, Andrew R., Whalley, David. C., Silberschmidt, Vadim. V.

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The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films von Zhang, Yan, Liu, Changqing, Whalley, David C

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Creep damage study at powercycling of lead-free surface mount device von Hegde, Pradeep, Whalley, David C., Silberschmidt, Vadim V.

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A novel flip-chip interconnection process for integrated circuits von Sugden, Mark W., Hutt, David A., Whalley, David C., Liu, Changqing

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An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies von Dou, Guangbin, Whalley, David C, Liu, Changqing, Chan, Y.C

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Mechanical characterization of individual Ni∕Au coated microsize polymer particles von Dou, Guangbin, Whalley, David C., Liu, Changqing

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Thermal and thermo-mechanical modelling of polymer overmoulded electronics von Sarvar, Farhad, Whalley, David C, Hutt, David A, Palmer, Paul J, Joo Teh, Nee

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Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection von Changqing Liu, Hendriksen, M.W., Hutt, D.A., Conway, P.P., Whalley, D.C.

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Mechanical characterization of individual Ni ∕ Au coated microsizepolymer particles von Dou, Guangbin, Whalley, David C., Liu, Changqing

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A simplified model of the reflow soldering process von Whalley, David C, Hyslop, Stuart M

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IGBT Package Design for High Power Aircraft Electronic Systems von Sarvar, Farhad, Whalley, David C, Low, Ming K

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Anisotropic conducting adhesives for electronic assembly von Whalley, David C, Mannan, Samjid H, Williams, David J

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An experimental methodology for the study of coplanarity variation effects in anisotropic conductive adhesive assemblies von Dou, Guangbin, Whalley, David C., Liu, Changqing, Chan, Y.C.

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Anisotropic conducting adhesives for electronic assembly von Whalley, David C, Mannan, Samjid H, Williams, David J

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Investigation of a solder bumping technique for flip-chip interconnection von Hutt, David A, Rhodes, Daniel G, Conway, Paul P, Mannan, Samjid H, Whalley, David C, Holmes, Andrew S

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Thermal Interface Materials - A Review of the State of the Art von Farhad Sarvar, Whalley, D.C., Conway, P.P.

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