Semiconductor package and method of attaching semiconductor dies to substrates von TAN BRYAN SOON HUA, CHOW SOO PIN, MANALAC RODEL, HETZEL WOLFGANG JOHANNES, ENG KIAN TENG, AMMER FLORIAN, ONG PANG HUP, CASTILLO DENVER PAUL C, REISS WERNER JOSEF

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COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS von HETZEL WOLFGANG JOHANNES, JIMMY SIAT, TENG ENG KIAN, CHUAN KOH YONG, REISS WERNER JOSEF, FLORAIN AMMER

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SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES von SOO PIN CHOW, RODEL MANALAC, WERNER JOSEF REISS, FLORIAN AMMER, PANG HUP ONG, BRYAN SOON HUA TAN, KIAN TENG ENG, DENVER PAUL C. CASTILLO, WOLFGANG JOHANNES HETZEL

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SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES von TAN BRYAN SOON HUA, CHOW SOO PIN, MANALAC RODEL, HETZEL WOLFGANG JOHANNES, ENG KIAN TENG, AMMER FLORIAN, ONG PANG HUP, CASTILLO DENVER PAUL C, REISS WERNER JOSEF

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COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT von JOHANNES HETZEL WOLFGANG, SIAT JIMMY, ENG KIAN TENG, AMMER FLORIAN, CHUAN KOH YONG, JOSEF REISS WERNER

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COPPER WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE MATERIALS von HETZEL WOLFGANG JOHANNES, SIAT JIMMY, TENG ENG KIAN, CHUAN KOH YONG, AMMER FLORAIN, REISS WERNER JOSEF

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Semiconductor arrangement for use in integrated circuit, has organic solderability preservative material applied to one of substrate and semiconductor chip, and copper wire wire-bo... von AMMER, FLORIAN, HETZEL, WOLFGANG, ENG, KIAN TENG, REISS, WERNER JOSEF, KOH, YONG CHUAN, SIAT, JIMMY

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SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES von CHOW SOO PIN, MANALAC RODEL, HETZEL WOLFGANG JOHANNES, ENG KIAN TENG, AMMER FLORIAN, TAN SOON HUA BRYAN, ONG PANG HUP, CASTILLO DENVER PAUL C, REISS WERNER JOSEF

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SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES von TAN BRYAN SOON HUA, CHOW SOO PIN, MANALAC RODEL, HETZEL WOLFGANG JOHANNES, ENG KIAN TENG, AMMER FLORIAN, ONG PANG HUP, CASTILLO DENVER PAUL C, REISS WERNER JOSEF

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Semiconductor package and method of attaching semiconductor dies to substrates von CASTILLO, DENVER PAUL C, AMMER, FLORIAN, TAN, BRYAN SOON HUA, CHOW, SOO PIN, MANALAC, RODEL, ENG, KIAN TENG, ONG, PANG HUP, REISS, WERNER JOSEF, HETZEL, WOLFGANG JOHANNES

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Copper wire bonding on organic solderability preservative materials von AMMER, FLORIAN, ENG, KIAN TENG, REISS, WERNER JOSEF, HETZEL, WOLFGANG JOHANNES, KOH, YONG CHUAN, SIAT, JIMMY

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Semiconductor package and method of attaching semiconductor dies to substrates von CASTILLO, DENVER PAUL C, AMMER, FLORIAN, TAN, BRYAN SOON HUA, CHOW, SOO PIN, MANALAC, RODEL, ENG, KIAN TENG, ONG, PANG HUP, REISS, WERNER JOSEF, HETZEL, WOLFGANG JOHANNES

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Halbleiter-Gehäuse und Verfahren zur Befestigung von Halbleiterchips an Substraten von CASTILLO, DENVER PAUL C, AMMER, FLORIAN, TAN, BRYAN SOON HUA, CHOW, SOO PIN, MANALAC, RODEL, ENG, KIAN TENG, ONG, PANG HUP, REISS, WERNER JOSEF, HETZEL, WOLFGANG JOHANNES

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The AlpArray Seismic Network: A Large-Scale European Experiment to Image the Alpine Orogen von Hetényi, György, Molinari, Irene, Clinton, John, Bokelmann, Götz, Bondár, István, Crawford, Wayne C., Dessa, Jean-Xavier, Doubre, Cécile, Friederich, Wolfgang, Fuchs, Florian, Giardini, Domenico, Gráczer, Zoltán, Handy, Mark R., Herak, Marijan, Jia, Yan, Kissling, Edi, Kopp, Heidrun, Korn, Michael, Margheriti, Lucia, Meier, Thomas, Mucciarelli, Marco, Paul, Anne, Pesaresi, Damiano, Piromallo, Claudia, Plenefisch, Thomas, Plomerová, Jaroslava, Ritter, Joachim, Rümpker, Georg, Šipka, Vesna, Spallarossa, Daniele, Thomas, Christine, Tilmann, Frederik, Wassermann, Joachim, Weber, Michael, Wéber, Zoltán, Wesztergom, Viktor, Živčić, Mladen

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Emergence of dendritic cells in rupture-prone regions of vulnerable carotid plaques von Yilmaz, Atilla, Lochno, Marlene, Traeg, Friedemann, Cicha, Iwona, Reiss, Christine, Stumpf, Christian, Raaz, Dorette, Anger, Thomas, Amann, Kerstin, Probst, Thomas, Ludwig, Josef, Daniel, Werner G, Garlichs, Christoph D

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Shear wave splitting in the Alpine region von Hein, Gerrit, Kolínský, Petr, Bianchi, Irene, Bokelmann, Götz

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The AlpArray Research Seismicity-Catalogue von Bagagli, M, Molinari, I, Diehl, T, Kissling, E, Giardini, D

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Coda-Q in the 2.5–20 s period band from seismic noise: application to the greater Alpine area von Soergel, D, Pedersen, H A, Stehly, L, Margerin, L, Paul, A

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On the wobbles of phase-velocity dispersion curves von Kolínský, Petr, Bokelmann, Götz

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Arrival angles of teleseismic fundamental mode Rayleigh waves across the AlpArray von Kolínský, Petr, Bokelmann, Götz

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