Visualization of Acoustic Waves and Cavitation in Ultrasonic Water Flow von Watanabe, Katsuhide, Matsuo, Hisanori, Ishibashi, Tomoatsu, Ando, Keita, Usui, Hidehisa

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Thickness Control Technology for CMP Process von WATANABE, Katsuhide

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The endpoint detection method using moiré pattern in CMP’s EPD system von Takitani, Sho, Yamamoto, Soma, Matsuo, Hisanori, Watanabe, Katsuhide, Suzuki, Keisuke

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Optimal Injection Distance in Ultrasonic Water Flow Cleaning von Sakota, Riria, Watanabe, Katsuhide, Matsuo, Hisanori, Ando, Keita, Ishibashi, Tomoatsu, Usui, Hidehisa

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Planarization profile modeling using pad bulk deformation and real contact area analysis of macro-scale device pattern von Jeong, Seonho, Jeong, Jongmin, Shin, Yeongil, Park, Youngwook, Kabasawa, Masashi, Hiyama, Hirokuni, Watanabe, Katsuhide, Matsuo, Hisanori, Wada, Yutaka, Jeong, Haedo

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Parametric Studies on Particle Removal and Erosion in Nozzle Injection Megasonic Cleaning von Watanabe, Katsuhide, Sakota, Riria, Matsuo, Hisanori, Ishibashi, Tomoatsu, Ando, Keita, Usui, Hidehisa

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Particle Removal in Ultrasonic Water Flow Cleaning Role of Cavitation Bubbles as Cleaning Agents von Sugawara, Mao, Ando, Keita, Sakota, Riria

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Physical Simulation and Visualization of the Marangoni Convection inside Meniscus Region under IPA Vapor in Wafer Drying Process von Ono, Naoki, Yamada, Takashi, Miura, Shumpei, Ishibashi, Tomoatsu, Matsuo, Hisanori, Watanabe, Katsuhide

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Design of a blind spatial and temporal RBF equalizer using a genetic algorithm von Watanabe, Katsuhide, Lin, Hai, Yamashita, Katsumi

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Polishing head system and polishing apparatus von Watanabe, Katsuhide, Kobata, Itsuki

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CMPプロセスの膜厚制御技術 von 渡辺, 和英

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Magnetically levitated vibration damping apparatus von Watanabe, Katsuhide

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Vibration damping apparatus von Watanabe, Katsuhide

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POLISHING HEAD SYSTEM AND POLISHING APPARATUS von Watanabe, Katsuhide, Kobata, Itsuki

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Eddy current sensor von Abe, Atsushi, Watanabe, Katsuhide, Takahashi, Taro

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SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SPECIFYING AREA TO BE PARTIALLY POLISHED BY SUBSTRATE PROCESSING APPARATUS von Katsuhide WATANABE, Itsuki KOBATA

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SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SPECIFYING AREA TO BE PARTIALLY POLISHED BY SUBSTRATE PROCESSING APPARATUS von WATANABE, Katsuhide, KOBATA, Itsuki

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Magnetic element and eddy current sensor using the same von Shibue, Hiroaki, Watanabe, Katsuhide, Takahashi, Taro

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Micro-Vibration Control by Active Magnetic Levitation System von WATANABE, Katsuhide, KANEMITSU, Yoichi, HARA, Shinji, HAGA, Takahide

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SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD von WATANABE, Katsuhide, KOBATA, Itsuki, FUKUNAGA, Akira, TSUJIMURA, Manabu

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