Variation in stress with background pressure in sputtered Mo/Si multilayer films von Windt, D. L., Brown, W. L., Volkert, C. A., Waskiewicz, W. K.

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Performance of an image adjustment device for SCALPEL von Waskiewicz, W.K.

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INTERFACE IMPERFECTIONS IN METAL/SI MULTILAYERS von WINDT, DL, HULL, R, WASKIEWICZ, WK

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Surface finish requirements for soft x-ray mirrors von Windt, D L, Waskiewicz, W K, Griffith, J E

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Monte Carlo study of high performance resists for SCALPEL nanolithography von Ocola, L.E., Li, W-Y., Kasica, R.J., Blakey, M.I., Orphanos, P.A., Waskiewicz, W.K., Novembre, A.E., Sato, M.

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Analysis of a SCALPEL™ multi-pass writing strategy von Zhu, X., Munro, E., Rouse, J.A., Liu, H., Waskiewicz, W.K.

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Global space charge effect in SCALPEL von Mkrtchyan, M., Munro, E., Liddle, J.A., Stanton, S.T., Waskiewicz, W.K., Farrow, R.C., Katsap, V.

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SCALPEL mark detection using Si/SiO2 and 100 keV backscattered electrons von Farrow, R. C., Mkrtchyan, M., Kizilyalli, I. C., Waskiewicz, W. K., Hopkins, L. C., Alakan, A., Gibson, G., Brown, P., Misra, S., Trimble, L.

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Marks for SCALPEL ® tool optics optimization von Farrow, R.C., Gallatin, G.M., Waskiewicz, W.K., Liddle, J.A., Kizilyalli, I., Kornblit, A., Biddick, C., Blakey, M., Klemens, F., Felker, J., Kraus, J., Mkrtchyan, M., Orphanos, P.A., Layadi, N., Merchant, S.

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An object pattern post-processor for validation of electron optical modelling von Munro, E., Zhu, X., Liu, H., Rouse, J.A., Waskiewicz, W.K.

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Ordering at Si(111)/a-Si and Si(111)/SiO2 interfaces von ROBINSON, I. K, WASKIEWICZ, W. K, TUNG, R. T, BOHR, J

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STRESS-RELAXATION IN MO/SI MULTILAYER STRUCTURES von KOLA, RR, WINDT, DL, WASKIEWICZ, WK, WEIR, BE, HULL, R, CELLER, GK, VOLKERT, CA

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CMOS compatible alignment marks for the SCALPEL proof of lithography tool von Farrow, R.C., Waskiewicz, W.K., Kizilyalli, I., Ocola, L., Felker, J., Biddick, C., Gallatin, G., Mkrtchyan, M., Blakey, M., Kraus, J., Novembre, A., Orphanos, P., Peabody, M., Kasica, R., Kornblit, A., Klemens, F.

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Optimization of a SCALPEL ® exposure tool using a diffractive image quality technique von Eichner, L., Blakey, M.I., Farrow, R.C., Liddle, J.A., Orphanos, P.A., Waskiewicz, W.K.

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Electron-optics method for high-throughput in a SCALPEL system: Preliminary analysis von Waskiewicz, W.K., Harriott, L.R., Liddle, J.A., Stanton, S.T., Berger, S.D., Munro, E., Zhu, X.

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Space-charge limitations to throughput in projection electron-beam lithography (SCALPEL) von Liddle, J.A., Blakey, M.I., Knurek, C.S., Mkrtchyan, M.M., Novembre, A.E., Ocola, L., Saunders, T., Waskiewicz, W.K.

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Mask technologies for soft-x-ray projection lithography at 13 nm von Tennant, D M, Fetter, L A, Harriott, L R, Macdowell, A A, Mulgrew, P P, Pastalan, J Z, Waskiewicz, W K, Windt, D L, Wood Ii, O R

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The SCALPEL proof of concept system von Harriott, L.R., Berger, S.D., Biddick, C., Blakey, M.I., Bowler, S.W., Brady, K., Camarda, R.M., Connelly, W.F., Crorken, A., Custy, J., DeMarco, R., Farrow, R.C., Felker, J.A., Fetter, L., Freeman, R., Hopkins, L., Huggins, H.A., Knurek, C.S., Kraus, J.S., Liddle, J.A., Mkrtychan, M., Novembre, A.E., Peabody, M.L., Tarascon, R.G., Wade, H.H., Waskiewicz, W.K., Watson, G.P., Werder, K.S., Windt, D.

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Soft-x-ray projection lithography experiments using Schwarzschild imaging optics von Tichenor, D A, Kubiak, G D, Malinowski, M E, Stulen, R H, Haney, S J, Berger, K W, Brown, L A, Sweatt, W C, Bjorkholm, J E, Freeman, R R, Himel, M D, Macdowell, A A, Tennant, D M, Wood, R, Bokor, J, Jewell, T E, Mansfield, W M, Waskiewicz, W K, White, D L, Windt, D L

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At‐wavelength metrology of 13 nm lithography imaging optics von Tan, Zhengquan, MacDowell, A. A., La Fontaine, B., Bjorkholm, J. E., Tennant, D., Taylor, D., Himel, M., Freeman, R. R., Waskiewicz, W. K., Windt, D. L., Spector, S., Ray‐Chaudhuri, A. K., Stulen, R. H., Ng, W., Cerrina, F.

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