5. Why study event-related potentials in Rett Syndrome? von Wark, James

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Discordant mental and physical efforts in an autistic patient von Ming, Xue, Julu, Peter O.O., Wark, James, Apartopoulos, Flora, Hansen, Stig

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A practical approach to uncomplicated seizures in children von McAbee, G N, Wark, J E

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8. Angelman Syndrome revisited: An update in 2011 von Niedermeyer, Lolita, Wark, James, Chu, Joseph, Hwang, Paul A

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SELECTIVE NICKEL PLATING OF ALUMINIUM, COPPER AND TUNGSTEN STRUCTURES von AKRAM, Salman, WARK, James, M, HIATT, William, M

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Semiconductor devices comprising nickel- and copper-containing interconnects von Wark, James M, Akram, Salman, Hiatt, William Mark

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SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTERCONNECTS von Wark, James M, Akram, Salman, Hiatt, William Mark

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Semiconductor devices comprising nickel- and copper-containing interconnects von Wark, James M, Akram, Salman, Hiatt, William Mark

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METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES von Akram Salman, Hiatt William Mark, Wark James M

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Tourette syndrome associated with unilateral cystic changes in the gyrus rectus von McAbee, Gary N., Wark, James E., Manning, Ana

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Methods of forming interconnects and semiconductor structures von Akram Salman, Hiatt William Mark, Wark James M

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Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice von WARK JAMES M

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Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice von Wark, James M

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Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice von Wark, James M

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Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice von WARK JAMES M

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Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice von Wark, James

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METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE VIAS SO FORMED von AKRAM, Salman, OLIVER, Steve, KIRBY, Kyle, K, WARK, James, M, HIATT, William, Mark, WOOD, Alan, G, RIGG, Sidney, B

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Method and apparatus for testing bumped die von Wark, James

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Method and apparatus for testing bumped die von Wark, James

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METHOD FOR FABRICATING AND FILLING CONDUCTIVE VIAS von AKRAM, Salman, OLIVER, Steve, KIRBY, Kyle, K, WARK, James, M, HIATT, William, Mark, WOOD, Alan, G, RIGG, Sidney, B

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