Sub-0.25 micron silicon via etching for 3D interconnects von Wang, Xiaodong, Zeng, Wanxue, Eisenbraun, Eric

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CVD of tantalum oxide dielectric thin films for nanoscale device applications von WANXUE ZENG, EISENBRAUN, Eric, FRISCH, Harry, SULLIVAN, John J, KALOYEROS, Alain E, MARGALIT, Jonathan, BECK, Karsten

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Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications von Consiglio, Steven, Zeng, Wanxue, Berliner, Nathaniel, Eisenbraun, Eric T.

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Low-temperature plasma-enhanced atomic layer deposition growth of WNxCy from a novel precursor for barrier applications in nanoscale devices von Zeng, Wanxue, Wang, Xiaodong, Kumar, Sumit, Peters, David W., Eisenbraun, Eric T.

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Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers von Wu, Liqi, Zeng, Wanxue, Eisenbraun, Eric

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Low-temperature plasma-enhanced atomic layer deposition growth of WNS), from a novel precursor for barrier applications in nanoscale devices von Zeng, Wanxue, Wang, Xiaodong, Kumar, Sumit, Eisenbraun, Eric T, Peters, David W

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Low-temperature plasma-enhanced atomic layer deposition growth of WN x C y from a novel precursor for barrier applications in nanoscale devices von Zeng, Wanxue, Wang, Xiaodong, Kumar, Sumit, Peters, David W., Eisenbraun, Eric T.

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Low Temperature ALD MoN for Applications in Nanoscale Devices von Zeng, Wanxue, Wang, Xiaodong, Meiere, Scott H., Eisenbraun, Eric

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ALD: Emerging Materials, Processes, and Nanoscale Technology Applications von Eisenbraun, Eric, Carpenter, Michael, Siddique, Rezina, Naczas, Sebastian, Zeng, Wanxue, Luo, Fu, Kaloyeros, Alain

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Low-temperature cis to trans isomerization reaction-separation membranes using zeolite 13X polyethylacrylate von Frisch, Harry L., Huang, Lei, Zeng, Wanxue

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Methods for improving adhesion on dielectric substrates von Zeng Wanxue, Si Weimin, Hong Ying, Zhong Lieping

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Low temperature inorganic chemical vapor deposition of Ti–Si–N diffusion barrier liners for gigascale copper interconnect applications von Eisenbraun, Eric, Upham, Allan, Dash, Raj, Zeng, Wanxue, Hoefnagels, Johann, Lane, Sarah, Anjum, Dalaver, Dovidenko, Katharine, Kaloyeros, Alain, Arkles, Barry, Sullivan, John J.

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METHODS FOR IMPROVING ADHESION ON DIELECTRIC SUBSTRATES von ZHONG LIEPING, SI WEIMIN, HONG YING, ZENG WANXUE

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Methods for improving adhesion on dielectric substrates von ZHONG LIEPING, SI WEIMIN, HONG YING, ZENG WANXUE

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High aspect ratio Bosch etching of sub- 0.25 μ m trenches for hyperintegration applications von Wang, Xiaodong, Zeng, Wanxue, Lu, Guoping, Russo, Onofrio L., Eisenbraun, Eric

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System and method for deposition in high aspect ratio magnetic writer heads von SI WEIMIN, HONG YING, ZENG WANXUE

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Methods for tunable plating seed step coverage von SI WEIMIN, BAI ZHIGANG, HONG YING, ZENG WANXUE

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WAFER PROCESSING APPARATUS HAVING A TUNABLE ELECTRICAL RESISTIVITY von ZENG, WANXUE, SCHAEPKENS, MARC, RUSINKO, DAVID, MICHAEL

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WAFER PROCESSING APPARATUS HAVING A TUNABLE ELECTRICAL RESISTIVITY von ZENG, WANXUE, SCHAEPKENS, MARC, RUSINKO, DAVID, MICHAEL

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Wafer processing apparatus having a tunable electrical resistivity von RUSINKO, JR. DAVID MICHAEL, ZENG WANXUE, SCHAEPKENS MARC

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