Interfacial toughness measurements for thin films on substrates von Volinsky, A.A, Moody, N.R, Gerberich, W.W

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Cyanide-free silver electroplating process in thiosulfate bath and microstructure analysis of Ag coatings von REN, Feng-zhang, YIN, Li-tao, WANG, Shan-shan, VOLINSKY, A.A., TIAN, Bao-hong

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3C-SiC Films on Si for MEMS Applications: Mechanical Properties von Volinsky, A.A., Kravchenko, G., Reddy, J. D., Waters, P., Frewin, Christopher L., Du, K., Locke, Christopher, Saddow, Stephen E.

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Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications von Vella, J B, Adhihetty, I S, Junker, K, Volinsky, A A

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Nanoindentation-induced defect–interface interactions: phenomena, methods and limitations von Gerberich, W.W., Kramer, D.E., Tymiak, N.I., Volinsky, A.A., Bahr, D.F., Kriese, M.D.

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Effects of quenching and tempering on the microstructure and bake hardening behavior of ferrite and dual phase steels von Kuang, C.F., Li, J., Zhang, S.G., Wang, J., Liu, H.F., Volinsky, A.A.

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Ion beam-mixed Ge electrodes for high capacity Li rechargeable batteries von Rudawski, N.G., Yates, B.R., Holzworth, M.R., Jones, K.S., Elliman, R.G., Volinsky, A.A.

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Control of the offset printing image quality indices von Varepo, L G, Brazhnikov, A Yu, Volinsky, A A, Nagornova, I V, Kondratov, A P

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Y Addition Effects on Hot Deformation Behavior of Cu-Zr Alloys with High Zr Content von Tian, K, Tian, B, Volinsky, A A, Zhang, Y, Liu, Y, Du, Y

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Internal stress analysis of electroplated films based on electron theory von REN, Feng-zhang, YIN, Li-tao, WANG, Shan-shan, XIONG, Yi, VOLINSKY, A.A., TIAN, Bao-hong, WEI, Shi-zhong

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Geometry effects on magnetoelectric performance of layered Ni/PZT composites von Pan, D.A., Tian, J.J., Zhang, S.G., Sun, J.S., Volinsky, A.A., Qiao, L.J.

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Elastic anisotropy effect on indentation-induced thin film interfacial delamination von Yang, B., Volinsky, A.A.

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Growth Rate Effect on 3C-SiC Film Residual Stress on (100) Si Substrates von Piluso, Nicolò, La Via, Francesco, Volinsky, A.A., Carballo, J., D'Arrigo, Giuseppe, Anzalone, Ruggero, Severino, Andrea, Locke, Christopher, Saddow, Stephen E.

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Stress Evaluation on Hetero-Epitaxial 3C-SiC Film on (100) Si Substrates von Severino, A., Camarda, M., La Via, F., Volinsky, A.A., Carballo, J., Piluso, N., Anzalone, Ruggero, Locke, C., D'Arrigo, G., Saddow, S.E.

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Y Addition Effects on Hot Deformation Behavior of Cu-Zr Alloys with High Zr Content von Tian, K., Tian, B., Volinsky, A.A., Zhang, Y., Liu, Y., Du, Y.

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Tensile crack patterns in Mo/Si multilayers on Si substrates under high-temperature bending von MEYER, D. C, LEISEGANG, T, LEVIN, A. A, PAUFLER, P, VOLINSKY, A. A

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Effects of near-tip rotation on pre-buckle crack growth of compressed beams bonded to a rigid substrate von Yang, Q.D., Volinsky, A.A.

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Gate oxide metrology and silicon piezooptics von Zollner, Stefan, Liu, Ran, Volinsky, A.A., White, Ted, Nguyen, Bich-Yen, Cook, C.S.

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Moisture Induced Degradation of Porous Low-k Materials von Baklanov, Mikhail, O'Dwyer, David, Urbanowicz, Adam, Le, Quoc Toan, Hong, Eun Kee

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