Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability von Kar, Yap Boon, Tahk, Noor Azrma, Seng, Foong Chee, Yang, Leong Hung, Vithyacharan, R., Yong, Tan Chou

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Effects of air temperature and velocity on the drying kinetics and product particle size of starch from arrowroot ( Maranta arundinacae ) von Caparanga, Alvin R., Reyes, Rachael Anne L., Rivas, Reiner L., De Vera, Flordeliza C., Retnasamy, Vithyacharan, Aris, Hasnizah

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The study of non-fouling and non-specific cellular binding on functionalized surface for mammalian cell identification and manipulation von Zainudin, Nor Syuhada, Hambali, Nor Azura Malini Ahmad, Wahid, Mohamad Halim Abd, Retnasamy, Vithyacharan, Shahimin, Mukhzeer Mohamad

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Operating Temperature Analysis of LED with Cylindrical Cu Slug von Retnasamy, Vithyacharan, Vairavan, Rajendaran, Sauli, Zaliman

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Interaction of Surface Roughness and Copper Ball Adhesion Using Shearing Simulation von Retnasamy, V., Sauli, Z., Shapri, A. H. M., Taniselass, S., Vairavan, R., Ramli, N.

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Shear Stress Analysis Study Using Surface Morphology Correlation with Aluminium Ball Adhesion von Retnasamy, V., Sauli, Z., Aziz, M. H. A., Hatta, R. M., Shapri, A. H. M., Taniselass, S.

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Shearing Speed Induced Stress Comparison on Gold and Copper Ball Interconnection von Sauli, Z., Retnasamy, V., Rahman, N. A., Norhaimi, W. M. W., Ramli, N., Vairavan, R.

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Gold Ball Shear Stress Analysis on Different Surface Morphology von Retnasamy, V., Sauli, Z., Rahman, N. A., Hatta, R. M., Vairavan, R., Norhaimi, W. M. W.

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Gold and Copper Ball Bond Shear Stress Comparison At Different Shear Tool Heights von Sauli, Zaliman, Retnasamy, V., Norhaimi, W. M. W., Taniselass, S., Ong, T. S., Vairavan, R.

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Stress Analysis on Through Holes in PCB von Sauli, Z., Retnasamy, V., Vengdasalam, K., Aziz, M. H. A., Hatta, R. M., Vairavan, R.

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Polymer Core BGA Vertical Stress Loading Analysis von Sauli, Z., Retnasamy, V., Taniselass, S., Shapri, A. H. M., Hatta, R. M., Aziz, M. H. A.

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