Substrate-embedded and flip-chip-bonded photodetector polymer-based optical interconnects: analysis, design, and performance von Glytsis, E.N., Jokerst, N.M., Villalaz, R.A., Sang-Yeon Cho, Shun-Der Wu, Zhaoran Huang, Brooke, M.A., Gaylord, T.K.

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Polylithic integration of electrical and optical interconnect technologies for gigascale fiber-to-the-chip communication von Mule', A.V., Villalaz, R.A., Joseph, P.J., Naeemi, A., Kohl, P.A., Gaylord, T.K., Meindl, J.D.

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Sea of polymer pillars: dual-mode electrical-optical Input/Output interconnections von Bakir, M.S., Villalaz, R.A., Ogunsola, O.O., Gaylord, T.K., Kohl, P.A., Martin, K.P., Meindl, J.D.

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