Brookite-rich titania films made by pulsed laser deposition von Moret, Mona P., Zallen, Richard, Vijay, Dilip P., Desu, Seshu B.

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Emerging Technologies in Displacement Amplification of Lever and Bridge-Type Compliant Mechanism: A Review Article von Kolate, Vijay Dilip, Darade, P. D., Deshmukh, Harshada, Patil, S. R.

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Oriented growth of SrBi2Ta2O9 ferroelectric thin films von Desu, Seshu B., Vijay, Dilip P., Zhang, X., He, BaoPing

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Reactive ion etching of lead zirconate titanate (PZT) thin film capacitors von VIJAY, D. P, DESU, S. B, PAN, W

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Novel fatigue-free layered structure ferroelectric thin films von Desu, Seshu B., Vijay, Dilip P.

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A Study to Evaluate the Usefulness of a Seven Feature, Fifteen-Point Histological Scoring System in the Interpretation of Histology in Neonatal Cholestasis von Gehlot, Yashvi, Ramrakhiani, Dilip, Shrimal, Rimjhim, Vijay, Priti, Saini, Lovesh

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c-Axis oriented ferroelectric SrBi2(TaxNb2-x)O9 thin films von DESU, S. B, VIJAY, D. P

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c-Axis oriented ferroelectric SrBi 2(Ta xNb 2− x)O 9 thin films von Desu, Seshu B., Vijay, Dilip P.

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c-Axis oriented ferroelectric SrBi sub(2)(Ta sub(x)Nb sub(2-x))O sub(9) thin films von Desu, Seshu B, Vijay, Dilip P

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ALTERNATE PAD STRUCTURES/PASSIVATION INTEGRATION SCHEMES TO REDUCE OR ELIMINATE IMC CRACKING IN POST WIRE BONDED DIES DURING CU/LOW-K BEOL PROCESSING von PALLINTI JAYANTHI, SUN SEY-SHING, BHATT HEMANSHU, YING HONG, KAO CHI-YI, VIJAY DILIP

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Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing von PALLINTI JAYANTHI, SUN SEY-SHING, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP

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Conducting oxide electrodes for ferroelectric films von Kwok, Chi K., Vijay, Dilip P., Desu, Seshu B., Parikh, Nalin R., Hill, Edward A.

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Modified sol-gel process for preparation of lead zjrconate titanate thin films von Kwok, Chi K., Desu, Seshu B., Vijay, Dilip P.

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Reduction of macro level stresses in copper/low-K wafers von PALLINTI JAYANTHI, SUN SEY-SHING, BURKE PETER, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP

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Reduction of macro level stresses in copper/low-K wafers von Sun, Sey-Shing, Pallinti, Jayanthi, Vijay, Dilip, Bhatt, Hemanshu, Ying, Hong, Kao, Chiyi, Burke, Peter

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Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing von PALLINTI JAYANTHI, LOW QWAI, SUN SEY-SHING, RANGANATHAN RAMASWAMY, BURKE PETER, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP

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Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing von Pallinti, Jayanthi, Vijay, Dilip, Bhatt, Hemanshu, Sun, Sey-Shing, Ying, Hong, Kao, Chiyi, Burke, Peter, Ranganathan, Ramaswamy, Low, Qwai

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Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing von PALLINTI JAYANTHI, SUN SEY-SHING, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP

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Reduction of macro level stresses in copper/Low-K wafers by altering aluminum pad/passivation stack to reduce or eliminate IMC cracking in post wire bonded dies von PALLINTI JAYANTHI, SUN SEY-SHING, BURKE PETER, BHATT HEMANSHU, KAO CHIYI, YING HONG, VIJAY DILIP

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Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing von Pallinti, Jayanthi, Vijay, Dilip, Bhatt, Hemanshu, Sun, Sey-Shing, Ying, Hong, Kao, Chiyi

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