Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions von Vianco, P. T., Kilgo, A. C., McKenzie, B. M., Grant, R. L., Williams, S.

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Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer. Part 2: Quantitative Compositional Analysis of Intermetallic Compound Reaction Layers von Vianco, P. T., Kilgo, A. C., McKenzie, B. B., Grant, R. P., Williams, S.

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Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model von Vianco, P. T., Rejent, J. A.

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Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism von Vianco, P. T., Cummings, D. P., Kotula, P. G., McKenzie, B. M., Lowery, L. M., Williams, S., Banga, D.

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Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films von Vianco, P. T., Neilsen, M. K., Rejent, J. A., Grant, R. P.

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Interface flow mechanism for tin whisker growth von Howard, H.P., Cheng, J., Vianco, P.T., Li, J.C.M.

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Properties of ternary Sn-ag-Bi solder alloys: Part I- Thermal properties and microstructural analysis von VIANCO, P. T, REJENT, J. A

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Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study von Vianco, P. T., Rejent, J. A.

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Properties of ternary Sn-ag-Bi solder alloys : Part II- Wettability and mechanical properties analyses von VIANCO, P. T, REJENT, J. A

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Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys von FREAR, D. R, VIANCO, P. T

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Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates von Susan, D. F., Rejent, J. A., Hlava, P. F., Vianco, P. T.

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Interface reactions between 50In–50Pb solder and electroplated Au layers von Vianco, P., Bryant, G., Hlava, P., Zender, G.

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A Practical Viscoplastic Damage Model for Lead-Free Solder von Fossum, A. F, Vianco, P. T, Neilsen, M. K, Pierce, D. M

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Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn 100Sn, and 63Sn-37Pb coatings von VIANCO, P. T, HLAVA, P. F, KILGO, A. C

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Interface reactions between copper and 50In-50Pb (wt%) alloy by solid-state aging von Vianco, P.T., Kilgo, A.C., McKenzie, B.M., Grant, R.L., Williams, S.

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Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder von VIANCO, Paul T, REJENT, Jerome A, KILGO, Alice C

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Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper von VIANCO, P. T, KILGO, A. C, GRANT, R

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Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue von Vianco, P T, Burchett, S N, Neilsen, M K, Rejent, J A, Frear, D R

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Evaluation of Lead- Free Solder Joints in Electronic Assemblies von Artaki, I., Jackson, A. M., Vianco, P. T.

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Optimum Thickness of Sn Film for Whisker Growth von Cheng, Jing, Yang, Fuqian, Vianco, Paul T., Zhang, Bei, Li, James C.M.

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