Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy von Martinez, M., Legros, M., Signamarcheix, T., Bally, L., Verrun, S., Di Cioccio, L., Deguet, C.

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Characterization of a SAW-Pirani vacuum sensor for two different operating modes von Mercier, D., Bordel, G., Brunet-Manquat, P., Verrun, S., Elmazria, O., Sarry, F., Belgacem, B., Bounoua, J.

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True 3D packaging solution for stacked vertical power devices von Rouger, N., Benaissa, L., Widiez, J., Imbert, B., Gaude, V., Verrun, S., Crebier, J. C.

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Reliability tests on micro-insert die bonding technology von Nowodzinski, A., Boutry, H., Franiatte, R., Mandrillon, V., Anciant, R., Verrun, S., Simon, G.

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3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies von Coudrain, P., Henry, D., Berthelot, A., Charbonnier, J., Verrun, S., Franiatte, R., Bouzaida, N., Cibrario, G., Calmon, F., O'Connor, I., Lacrevaz, T., Fourneaud, L., Flechet, B., Chevrier, N., Farcy, A., Le-Briz, O.

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Saw-Pirani vacuum sensor with a new functioning mode and a fast response time von Mercier, D., Bordel, G., Brunet-Manquat, P., Verrun, S., Elmazria, O., Sarry, F., Belgacem, B., Bounouar, J.

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First integration of Cu TSV using die-to-wafer direct bonding and planarization von Leduc, P., Assous, M., Di Cioccio, L., Zussy, M., Signamarcheix, T., Roman, A., Rousseau, M., Verrun, S., Bally, L., Bouchu, D., Cadix, L., Farcy, A., Sillon, N.

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3D integration technology for set-top box application von Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Saugier, E.

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3D integration process flow for set-top box application: Description of technology and electrical results von Cheramy, S., Charbonnier, J., Henry, D., Astier, A., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Vittu, J.

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An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling von Di Cioccio, L., Gueguen, P., Taibi, R., Signamarcheix, T., Bally, L., Vandroux, L., Zussy, M., Verrun, S., Dechamp, J., Leduc, P., Assous, M., Bouchu, D., de Crecy, F., Chapelon, L.-L., Clavelier, L.

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Development and characterisation of high electrical performances TSV for 3D applications von Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Garnier, G., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Farcy, A., Cadix, L., Rousseau, M., Saugier, E.

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High-performance silver-dielectric interference filters for RGBIR imaging von Frey, Laurent, Masarotto, Lilian, El Melhaoui, Loubna, Verrun, Sophie, Minoret, Stéphane, Rodriguez, Guillaume, André, Agathe, Ritton, Frédéric, Parrein, Pascale

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High pass filter with above IC integrated SrTiO3 high K MIM capacitors von DELAY, Emmanuel, WOLOZAN, David, ULMER, Laurent, AÏD, Marc, ANCEY, Pascal, BLANC, Jean-Pierre, SERRET, Emmanuelle, GARREC, Pierre, VERRUN, Sophie, PELLISSIER, Denis, DELPECH, Philippe, GUILLAN, Julie, ANDRE, Bernard

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Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member von BRUN JEAN, VICARD DOMINIQUE, VERRUN SOPHIE

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RECONSTITUTED ELECTRONIC DEVICE FABRICATION PROCESS AND CORRESPONDING RECONSTITUTED ELECTRONIC DEVICE von BALERAS, François, POUPON, Gilles, SOURIAU, Jean-Charles, VERRUN, Sophie

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High pass filter with above IC integrated SrTiO 3 high K MIM capacitors von Defaÿ, Emmanuel, Wolozan, David, Blanc, Jean-Pierre, Serret, Emmanuelle, Garrec, Pierre, Verrun, Sophie, Pellissier, Denis, Delpech, Philippe, Guillan, Julie, André, Bernard, Ulmer, Laurent, Aïd, Marc, Ancey, Pascal

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Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it von BRUN JEAN, VICARD DOMINIQUE, VERRUN SOPHIE

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ASSEMBLY OF A GROOVED MICROELECTRONIC CHIP WITH A TOROIDAL WIRE ELEMENT AND METHOD OF ASSEMBLING IT von BRUN, Jean, VICARD, Dominique, VERRUN, Sophie

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Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member von BRUN JEAN, VICARD DOMINIQUE, VERRUN SOPHIE

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Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it von BRUN JEAN, VICARD DOMINIQUE, VERRUN SOPHIE

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