Treatment of AlSi12 feedstock with water to manufacture multi-material parts by laser powder bed fusion process: A potential route for the fabrication of inorganic 3D metamaterials von Lanoue, F., Veron, F., Pasquet, I., Kiryukhina, K., Baco-Carles, V., Vendier, O., Tailhades, Ph

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Compact Self-Biased Q-Band Circulators von Parker-Soues, N., Noutehou, N., Patris, C., Nevo, D., Mattei, J. L., Lebourgeois, R., Vendier, O., Roux, J. L., Laur, V.

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Reliability modeling of capacitive RF MEMS von Melle, S., De Conto, D., Dubuc, D., Grenier, K., Vendier, O., Muraro, J.-L., Cazaux, J.-L., Plana, R.

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Improved thermal management for GaN power electronics: Silver diamond composite packages von Faqir, M., Batten, T., Mrotzek, T., Knippscheer, S., Massiot, M., Buchta, M., Blanck, H., Rochette, S., Vendier, O., Kuball, M.

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Sub-hundred nanosecond electrostatic actuated RF MEMS switched capacitors von Verger, A, Pothier, A, Guines, C, Crunteanu, A, Blondy, P, Orlianges, J-C, Dhennin, J, Broue, A, Courtade, F, Vendier, O

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Pattern reconfiguration of microstrip antenna using flip-chip mounted packaged MEMS von Raj, R., Poussot, B., Laheurte, J.-M., Vendier, O.

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Failure predictive model of capacitive RF-MEMS von Mellé, S., De Conto, D., Mazenq, L., Dubuc, D., Poussard, B., Bordas, C., Grenier, K., Bary, L., Vendier, O., Muraro, J.L., Cazaux, J.L., Plana, R.

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Colloidal Solutions of Organic Conductive Nanoparticles von de Caro, Dominique, Souque, Matthieu, Faulmann, Christophe, Coppel, Yannick, Valade, Lydie, Fraxedas, Jordi, Vendier, Olivier, Courtade, Frédéric

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Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite von FAQIR, M, POMEROY, J. W, COURTADE, F, KUBALL, M, BATTEN, T, MROTZEK, T, KNIPPSCHEER, S, VENDIER, O, ROCHETTE, S, MASSIOT, M, LETTERON, L, DESMARRES, J. M

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Silver oxalate-based solders: New materials for high thermal conductivity microjoining von Kiryukhina, K., Le Trong, H., Tailhades, Ph, Lacaze, J., Baco, V., Gougeon, M., Courtade, F., Dareys, S., Vendier, O., Raynaud, L.

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Gamma radiation effects on RF MEMS capacitive switches von Crunteanu, A., Pothier, A., Blondy, P., Dumas-Bouchiat, F., Champeaux, C., Catherinot, A., Tristant, P., Vendier, O., Drevon, C., Cazaux, J.L., Marchand, L.

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A surface-mountable membrane supported filter von Chatras, M., Blondy, P., Cros, D., Vendier, O., Cazaux, J.L.

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Thick-slot transition and antenna arrays in the Q band von Lafond, O., Himdi, M., Vendier, O., Cailloce, Y.

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Sub-hundred nanosecond reconfiguration capabilities of nanogap RF MEMS switched capacitor von Verger, A, Pothier, A, Guines, C, Crunteanu, A, Blondy, P, Orlianges, J C, Dhennin, J, Courtade, F, Vendier, O

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New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography von FAQIR, M, MANOI, A, MROTZEK, T, KNIPPSCHEER, S, MASSIOT, M, BUCHTA, M, BLANCK, H, ROCHETTE, S, VENDIER, O, KUBALL, M

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Silver diamond composite as a new packaging solution: A thermo-mechanical stability study von Faqir, M, Batten, T, Mrotzek, T, Knippscheer, S, Massiot, M, Letteron, L, Rochette, S, Vendier, O, Desmarres, J M, Courtade, F, Kuball, M

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Smart MEMS concept for high secure RF and millimeterwave communications von Dubuc, D., Saddaoui, M., Melle, S., Flourens, F., Rabbia, L., Ducarouge, B., Grenier, K., Pons, P., Boukabache, A, Bary, L., Takacs, A., Aubert, H., Vendier, O., Roux, J.L., Plana, R.

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Modeling of the dielectric charging kinetic for capacitive RF-MEMS von Melle, S., De Conto, D., Mazenq L, Dubuc, D., Grenier, K., Bary, L., Plana, R., Vendier, O., Muraro, J.L., Cazaux, J.L.

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Thin-film inverted MSM photodetectors von Vendier, O., Jokerst, N.M., Leavitt, R.P.

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Thermal modeling and management in ultrathin chip stack technology von Pinel, S., Marty, A., Tasselli, J., Bailbe, J.-P., Beyne, E., Van Hoof, R., Marco, S., Morante, J.R., Vendier, O., Huan, M.

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