Effect of Cu(II) ligands on electroless copper deposition rate in formaldehyde solutions : An EQCM study von PAULIUKAITE, R, STALNIONIS, G, JUSYS, Z, VASKELIS, A

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In commemoration of juozas Matulis’ centenary von Vaskelis, A.

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Structure of electroless silver coatings obtained using cobalt(II) as reducing agent von Vaskelis, A., Jagminiené, A., Juškénas, R., Matulionis, E., Norkus, E.

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Obtaining of high surface roughness copper deposits by electroless plating technique von Norkus, Eugenijus, Vaškelis, Algirdas, Jačiauskienė, Janė, Stalnionienė, Irena, Stalnionis, Giedrius

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Mechanism of copper(II) reduction by formaldehyde studied by on-line mass spectrometry von Jusys, Z, Vaskelis, A

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Autocatalytic processes of copper(II) and silver(I) reduction by cobalt(II) complexes von Vaškelis, A., Norkus, E.

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Silver nanostructured catalyst for modification of dielectrics surface von Vaškelis, Algirdas, Jagminienė, Aldona, Tamašauskaitė–Tamašiūnaitė, Loreta, Juškėnas, Remigijus

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EQCM study of the effect of ligands on the rate of CUII reduction by formaldehyde von JUSYS, Z, PAULIUKAITE, R, VASKELIS, A

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Differential electrochemical mass spectrometry study of the electroless copper plating process using a thin-layer flow-through cell von Vaškelis, A., Jusys, Z.

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Mass spectrometric cyclic voltammetry of copper in alkaline formaldehyde solutions von Jusys, Z., Vaškelis, A.

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Effect of the Cu electrode formation conditions and surface nano-scale roughness on formaldehyde anodic oxidation von Vaškelis, Algirdas, Norkus, Eugenijus, Stalnionien≐, Irena, Stalnionis, Giedrius

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Cyclic voltammetry and quartz crystal microgravimetry study of autocatalytic copper(II) reduction by cobalt(II) in ethylenediamine solutions von Vaškelis, A, Stalnionis, G, Jusys, Z

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Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands von Norkus, E, Vaskelis, A, Jaciauskiene, J, Vaiciuniene, J, Gaidamauskas, E, Macalady, D L

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The mechanism of electroless Ni-P deposition studied by electrochemical mass spectrometry von Jusys, Z., Liaukonis, J., Vaškelis, A.

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Copper hydride formation in the electroless copper plating process: in situ X-ray diffraction evidence and electrochemical study von VASKELIS, A, JUSKENAS, R, JACIAUSKIENE, J

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Obtaining of IB group metal films by novel electroless deposition method von Vaškelis, A., Jačiauskien≐, J., Jagminien≐, A., Norkus, E.

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Cobalt(II) anodic oxidation on silver in ammonia and ethylenediamine solutions studied by rotating disc electrode and EQCM techniques von VASKELIS, A, JAGMINIENE, A, TAMASAUSKAITE-TAMASIUNAITE, L

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Kinetics of electroless copper deposition using cobalt(II)-ethylenediamine complex compounds as reducing agents von VASKELIS, A, NORKUS, E, JACIAUSKIENE, J

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Effect of the Cu electrode formation conditions and surface nano-scale roughness on formaldehyde anodic oxidation von VASKELIS, Algirdas, NORKUS, Eugenijus, STALNIONIENE, Irena, STALNIONIS, Giedrius

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Electrocatalytic oxidation of formaldehyde on copper single crystal electrodes in alkaline solutions von Ramanauskas, R., Jurgaitien≐, I., Vas̆kelis, A.

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