Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma von Shamiryan, D., Baklanov, M. R., Vanhaelemeersch, S., Maex, K.

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High aspect ratio via etch development for Cu nails in 3-D-stacked ICs von Van Aelst, J., Struyf, H., Boullart, W., Vanhaelemeersch, S.

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Minimizing plasma damage and in situ sealing of ultralow- k dielectric films by using oxygen free fluorocarbon plasmas von Mannaert, G., Baklanov, M. R., Le, Q. T., Travaly, Y., Boullart, W., Vanhaelemeersch, S., Jonas, A. M.

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Comparative study of PECVD SiOCH low-k films obtained at different deposition conditions von Shamiryan, D, Weidner, K, Gray, W.D, Baklanov, M.R, Vanhaelemeersch, S, Maex, K

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Monitoring plasma nitridation of HfSiOx by corona charge measurements von EVERAERT, J.-L, SHI, X, ROTHSCHILD, A, SCHAEKERS, M, ROSSEEL, E, PAVELKA, T, DON, E, VANHAELEMEERSCH, S

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Wet Etch Characteristics of Hafnium Silicate Layers von Claes, M., Paraschiv, V., Dictus, D., Conard, T., Delabie, A., Van Elshocht, S., Zhao, C., Everaert, J.-L., Boullart, W., Vanhaelemeersch, S., De Gendt, S.

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Polymer dielectric treatment using ultraviolet-ozone: A photoelectron spectroscopy and ellipsometric porosimetry study von Toan Le, Quoc, Whelan, C. M., Struyf, H., Vanhaelemeersch, S., Azioune, A., Louette, P., Pireaux, J.-J., Maex, K.

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Process Optimization and Integration of Trimethylsilane-Deposited α-SiC:H and α-SiCO:H Dielectric Thin Films for Damascene Processing von Gray, W. D., Loboda, M. J., Bremmer, J. N., Struyf, H., Lepage, M., Van Hove, M., Donaton, R. A., Sleeckx, E., Stucchi, M., Lanckmans, F., Gao, T., Boullart, W., Coenegrachts, B., Maenhoudt, M., Vanhaelemeersch, S., Meynen, H., Maex, K.

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Implementation of high- k and metal gate materials for the 45 nm node and beyond: gate patterning development von Beckx, S., Demand, M., Locorotondo, S., Henson, K., Claes, M., Paraschiv, V., Shamiryan, D., Jaenen, P., Boullart, W., Degendt, S., Biesemans, S., Vanhaelemeersch, S., Vertommen, J., Coenegrachts, B.

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Integration of Cu and low- k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures von Donaton, R.A., Coenegrachts, B., Maenhoudt, M., Pollentier, I., Struyf, H., Vanhaelemeersch, S., Vos, I., Meuris, M., Fyen, W., Beyer, G., Tokei, Z., Stucchi, M., Vervoort, I., De Roest, D., Maex, K.

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Characterisation and integration feasibility of JSR’s low- k dielectric LKD-5109 von Das, A, Kokubo, T, Furukawa, Y, Struyf, H, Vos, I, Sijmus, B, Iacopi, F, Van. Aelst, J, Le, Q.T, Carbonell, L, Brongersma, S, Maenhoudt, M, Tokei, Z, Vervoort, I, Sleeckx, E, Stucchi, M, Schaekers, M, Boullart, W, Rosseel, E, Van Hove, M, Vanhaelemeersch, S, Shiota, A, Maex, K

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HF Based Solutions for HfO2 Removal; Effect of pH and Temperature on HfO2: SiO2 Etch Selectivity von Claes, Martine, De Gendt, Stefan, Boullart, Werner, Paraschiv, Vasile, Vanhaelemeersch, Serge, Baklanov, Mikhail R.

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The etching behavior of tungsten (W) with respect to the orientation of the grain boundary and masking layers von Lee, H.C, Vanhaelemeersch, S

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Limitation of HF-based chemistry for deep-submicron contact hole cleaning on silicides von BAKLANOV, M. R, KONDOH, E, DONATON, R. A, VANHAELEMEERSCH, S, MAEX, K

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Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film von TRAVALY, Y, EYCKENS, B, SCHAEKERS, M, BENDER, H, ROSSEEL, E, VANHAELEMEERSCH, S, MAEX, K, GAILLARD, F, VAN AUTRYVE, L, RABINZOHN, P, CARBONEL, L, ROTHSCHILD, A, LE, Q. T, BRONGERSMA, S. H, CIOFI, I, STRUYF, H, FURUKAWA, Y, STUCCHI, M

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Chemical and structural analysis of etching residue layers in semiconductor devices with energy filtering transmission electron microscopy von Hens, S., Van Landuyt, J., Bender, H., Boullart, W., Vanhaelemeersch, S.

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SiF2 as a primary desorption product of Si etching by F atoms : interpretation of laser-induced fluorescence spectra ; rate constant of the gas phase SiF2+F reaction von VANHAELEMEERSCH, S, VAN HOEYMISSEN, J, VERMEYLEN, D, PEETERS, J

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Modification of Low-K SiCOH Film Porosity by a HF Solution von Shamiryan, Denis, Vanhaelemeersch, Serge, Vereecke, Guy, Maex, Karen, Baklanov, Mikhail R.

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Post Dry-Etch Cleaning Issues of an Organic Low-K Dielectric von Alaerts, C., Vanhaelemeersch, Serge, Lanckmans, F., Maex, Karen, Baklanov, Mikhail R.

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Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning von Beckx, B., Vanhaelemeersch, Serge, Vandervorst, W., Kim, Y.B.

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