Comparison of PbI2 and HgI2 for direct detection active matrix x-ray image sensors von Street, R. A., Ready, S. E., Van Schuylenbergh, K., Ho, J., Boyce, J. B., Nylen, P., Shah, K., Melekhov, L., Hermon, H.

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Out-of-plane high-Q inductors on low-resistance silicon von Chua, C.L., Fork, D.K., Van Schuylenbergh, K., Jeng-Ping Lu

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Laser processing of amorphous silicon for large-area polysilicon imagers von Boyce, J.B., Fulks, R.T., Ho, J., Lau, R., Lu, J.P., Mei, P., Street, R.A., Van Schuylenbergh, K.F., Wang, Y.

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Flat panel imagers with pixel level amplifiers based on polycrystalline silicon thin-film transistor technology von Lu, J. P., Van Schuylenbergh, K., Ho, J., Wang, Y., Boyce, J. B., Street, R. A.

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Concept, design and fabrication of smart orthopedic implants von Burny, F, Donkerwolcke, M, Moulart, F, Bourgois, R, Puers, R, Van Schuylenbergh, K, Barbosa, M, Paiva, O, Rodes, F, Bégueret, J.B, Lawes, P

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Pressure Contact Micro-Springs in Small Pitch Flip-Chip Packages von Chow, E.M., Chua, C., Hantschel, T., Van Schuylenbergh, K., Fork, D.K.

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Crosstalk and lateral conduction effects in continuous-sensor amorphous silicon imagers von Mulato, M., Ready, S., Van Schuylenbergh, K., Lu, J. P., Street, R. A.

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Pulsed laser crystallization of amorphous silicon for polysilicon flat panel imagers von Boyce, J.B., Lu, J.P., Ho, J., Street, R.A., van Schuylenbergh, K., Wang, Y.

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Micro-electro-mechanical system fabrication technology applied to large area x-ray image sensor arrays von Daniel, J. H., Krusor, B., Apte, R. B., Mulato, M., Van Schuylenbergh, K., Lau, R., Do, T., Street, R. A., Goredema, A., Boils-Boissier, D. C., Kazmaier, P. M.

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Low-noise monolithic oscillator with an integrated three-dimensional inductor von Van Schuylenbergh, K., Griffiths, B., Chua, C.L., Fork, D.K., Jeng-Ping Lu

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Wafer-Level Packaging With Soldered Stress-Engineered Micro-Springs von Chow, E.M., Fork, D.K., Chua, C.L., Van Schuylenbergh, K., Hantschel, T.

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Solder-Free Pressure Contact Micro-Springs in High-Density Flip-Chip Packages von Chow, E.M., Chua, C., Hantschel, T., van Schuylenbergh, K., Fork, D.K.

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On-chip out-of-plane high-Q inductors von Van Schuylenbergh, K., Chua, C.L., Fork, D.K., Jeng-Ping Lu, Griffiths, B.

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Micro-spring force characterization and applications in integrated circuit packaging and scanning probe MEMS metrology von Chow, E.M., Hantschel, T., Klein, K., Fork, D.K., Chua, C.L., Wong, L., Van Schuylenbergh, K.

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Self-assembled out-of-plane high-Q integrated inductors von Van Schuylenbergh, K., Chua, C.L., Fork, D.K., Jeng-Ping Lu, Griffiths, B.

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Pulsed laser crystallization of amorphous silicon for polysilicon flat panel imagers von BOYCE, J. B, LU, J. P, HO, J, STREET, R. A, VAN SCHUYLENBERGH, K, WANG, Y

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Passive telemetry by harmonics detection von Van Schuylenbergh, K., Puers, R.

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Self Tuning Inductive Powering For Implantable Telemetric Monitoring Systems von Van Schuylenbergh, K., Puers, R.

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Intermittency study of a stressed-metal micro-spring sliding electrical contact von Chow, E.M., Klein, K., Fork, D.K., Hamschel, T., Chua, C.L., Lai Wong, Van Schuylenbergh, K.

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Excimer laser annealed, poly-Si thin film transistors for flat panel imager application von Lu, J.P., Van Schuylenbergh, K., Ho, J., Wang, Y., Nylen, P., Boyce, J.B., Street, R.A.

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