AOSpine Consensus Paper on Nomenclature for Working-Channel Endoscopic Spinal Procedures von Hofstetter, Christoph P., Ahn, Yong, Choi, Gun, Gibson, J. N. A., Ruetten, S., Zhou, Yue, Li, Zhen Zhou, Siepe, Christoph J., Wagner, Ralf, Lee, Jun-Ho, Sairyo, Koichi, Choi, Kyung Chul, Chen, Chien-Min, Telfeian, A. E., Zhang, Xifeng, Banhot, Arun, Lokhande, Pramod V., Prada, N., Shen, Jian, Cortinas, F. C., Brooks, N. P., Van Daele, Peter, Kotheeranurak, Vit, Hasan, Saqib, Keorochana, Gun, Assous, Mohammed, Härtl, Roger, Kim, Jin-Sung

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Ultrathin Optoelectronic Device Packaging in Flexible Carriers von Bosman, E, Missinne, J, Van Hoe, B, Van Steenberge, G, Kalathimekkad, S, Van Erps, J, Milenkov, I, Panajotov, K, Van Gijseghem, T, Dubruel, P, Thienpont, H, Daele, P

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Guest Editorial: Special Issue on the 2020 European Conference on Optical Communication von Van Daele, Peter, Koonen, Ton, Bauwelinck, Johan, Raz, Oded

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Percutaneous full endoscopic foraminotomy for treatment of cervical spinal nerve compression in horses using a uniportal approach: Feasibility study von Swagemakers, Jan‐Hein, Van Daele, Peter, Mageed, Mahmoud

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Introduction to the ECOC 2020 Special Issue von Van Daele, Peter, Koonen, Ton, Bauwelinck, Johan, Raz, Oded

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Will Zero Vulnerability Computing (ZVC) Ever Be Possible? Testing the Hypothesis von Raheman, Fazal, Bhagat, Tejas, Vermeulen, Brecht, Van Daele, Peter

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Ultra Small Integrated Optical Fiber Sensing System von Van Hoe, Bram, Lee, Graham, Bosman, Erwin, Missinne, Jeroen, Kalathimekkad, Sandeep, Maskery, Oliver, Webb, David J., Sugden, Kate, Van Daele, Peter, Van Steenberge, Geert

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Two axis optoelectronic tactile shear stress sensor von Missinne, Jeroen, Bosman, Erwin, Van Hoe, Bram, Verplancke, Rik, Van Steenberge, Geert, Kalathimekkad, Sandeep, Van Daele, Peter, Vanfleteren, Jan

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Direct writing of microlenses in polycarbonate with excimer laser ablation von Naessens, Kris, Ottevaere, Heidi, Baets, Roel, Van Daele, Peter, Thienpont, Hugo

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Will Zero Vulnerability Computing (ZVC) ever be possible? Testing the hypothesis von Raheman, Fazal, Bhagat, Tejas, Vermeulen, Brecht, Van Daele, Peter

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An out-of-plane grating coupler for efficient butt-coupling between compact planar waveguides and single-mode fibers von Taillaert, D., Bogaerts, W., Bienstman, P., Krauss, T.F., Van Daele, P., Moerman, I., Verstuyft, S., De Mesel, K., Baets, R.

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Flexible Shear Sensor Based on Embedded Optoelectronic Components von Missinne, J, Bosman, E, Van Hoe, B, Van Steenberge, G, Kalathimekkad, S, Van Daele, P, Vanfleteren, J

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Highly Reliable Flexible Active Optical Links von Bosman, E., Van Steenberge, G., Van Hoe, B., Missinne, J., Vanfleteren, J., Van Daele, P.

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Introduction: ECOC 2012 in Amsterdam von Koonen, Ton, van Daele, Peter, Demeester, Piet, Dorren, Harm

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Laser ablation of parallel optical interconnect waveguides von Van Steenberge, G., Hendrickx, N., Bosman, E., Van Erps, J., Thienpont, H., Van Daele, P.

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MT-compatible laser-ablated interconnections for optical printed circuit boards von Van Steenberge, G., Geerinck, P., Van Put, S., Van Koetsem, J., Ottevaere, H., Morlion, D., Thienpont, H., Van Daele, P.

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Discrete Out-of-Plane Coupling Components for Printed Circuit Board-Level Optical Interconnections von Van Erps, J., Hendrickx, N., Debaes, C., Van Daele, P., Thienpont, H.

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Embedded Micromirror Inserts for Optical Printed Circuit Boards von Hendrickx, N., Van Erps, J., Bosman, E., Debaes, C., Thienpont, H., Van Daele, P.

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A review on fabrication technologies for the monolithic integration of tapers with III-V semiconductor devices von Moerman, I., Van Daele, P.P., Demeester, P.M.

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Laser Ablated Micromirrors for Printed Circuit Board Integrated Optical Interconnections von Hendrickx, N., Van Erps, J., Van Steenberge, G., Thienpont, H., Van Daele, P.

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