Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films von Broas, Mikael, Jiang, Hua, Graff, Andreas, Sajavaara, Timo, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

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Void formation and its impact on Cu Sn intermetallic compound formation von Ross, Glenn, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

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Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability von Broas, Mikael, Kanninen, Olli, Vuorinen, Vesa, Tilli, Markku, Paulasto-Kröckel, Mervi

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Inorganic particulate matter in the lung tissue of idiopathic pulmonary fibrosis patients reflects population density and fine particle levels von Mäkelä, Kati, Ollila, Hely, Sutinen, Eva, Vuorinen, Vesa, Peltola, Emilia, Kaarteenaho, Riitta, Myllärniemi, Marjukka

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Mechanical Analysis of Ultrasound-Activated Pins and Resorbable Screws: Two Different Techniques to Fixate Osteosynthesis in Craniosynostosis Surgery von Savolainen, Mikko J, Ritvanen, Antti G, Koljonen, Virve S, Turunen, Markus P K, Hulkkonen, Hanna H, Vuorinen, Vesa H O, Leikola, Junnu P

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Solid-state reactions between Cu(Ni) alloys and Sn von VUORINEN, Vesa, LAURILA, Tomi, MATTILA, Toni, HEIKINHEIMO, Erkki, KIVILAHTI, Jorma K

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Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs von Tiwary, Nikhilendu, Ross, Glenn, Vuorinen, Vesa, Paulasto-Krockel, Mervi

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Interfacial void segregation of Cl in Cu-Sn micro-connects von Ross, Glenn, Tao, Xiaoma, Broas, Mikael, Mäntyoja, Nikolai, Vuorinen, Vesa, Graff, Andreas, Altmann, Frank, Petzold, Matthias, Paulasto-Kröckel, Mervi

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Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C von Golim, Obert, Vuorinen, Vesa, Ross, Glenn, Wernicke, Tobias, Pawlak, Marta, Tiwary, Nikhilendu, Paulasto-Kröckel, Mervi

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Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test von Liu, Shenyi, Vuorinen, Vesa, Liu, Xing, Fredrikson, Olli, Brand, Sebastian, Tiwary, Nikhilendu, Lutz, Josef, Paulasto-Krockel, Mervi

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Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging von Golim, Obert, Vuorinen, Vesa, Wernicke, Tobias, Pawlak, Marta, Paulasto-Kröckel, Mervi

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Bonding of ceramics to silver‐coated titanium—A combined theoretical and experimental study von Vuorinen, Vesa, Kouhia, Reijo, Könönen, Mauno, Kivilahti, Jorma K.

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Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects von Golim, Obert, Vuorinen, Vesa, Ross, Glenn, Suihkonen, Sami, Paulasto-Kröckel, Mervi

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Effect of CoCr Counterface Roughness on the Wear of UHMWPE in the Noncyclic RandomPOD Simulation von Saikko, Vesa, Vuorinen, Vesa, Revitzer, Hannu

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Finite Element Simulation of Solid-Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress von Tiwary, Nikhilendu, Vuorinen, Vesa, Ross, Glenn, Paulasto-Krockel, Mervi

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Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability von Emadi, Fahimeh, Vuorinen, Vesa, Liu, Shenyi, Paulasto-Krockel, Mervi

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Void formation and its impact on CuSn intermetallic compound formation von Ross, Glenn, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

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In-situ annealing characterization of atomic-layer-deposited Al2O3 in N2, H2 and vacuum atmospheres von Broas, Mikael, Lemettinen, Jori, Sajavaara, Timo, Tilli, Markku, Vuorinen, Vesa, Suihkonen, Sami, Paulasto-Kröckel, Mervi

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Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections von Dong, Hongqun, Vuorinen, Vesa, Laurila, Tomi, Paulasto-Kröckel, Mervi

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Wafer-Level AuSn/Pt Solid-Liquid Interdiffusion Bonding von Rautiainen, Antti, Vuorinen, Vesa, Heikkinen, Hannele, Paulasto-Krockel, Mervi

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