Structural and electrical evolution of the Al/RuO2 interface upon thermal annealing von VU, Q. T, KOLAWA, E, NICOLET, M.-A

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Inhomogeneous defect activation by rapid thermal processes in silicon von VU THUONG-QUAT, EICHHAMMER, W, SIFFERT, P

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Encapsulated copper interconnection devices using sidewall barriers von Gardner, Donald S., Onuki, Jin, Kudoo, Kazue, Misawa, Yutaka, Vu, Quat T.

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Electron diffusion length in rapid thermal processed p-type silicon von QUAT, V. T, EICHHAMMER, W, SIFFERT, P

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Structural and electrical evolution of the Al/RuO 2 interface upon thermal annealing von Vu, Quat T., Kolawa, E., Nicolet, M.-A.

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Gettering of gold by rapid thermal processing von HARTITI, B, VU-THUONG QUAT, EICHHAMMER, W, MULLER, J.-C, SIFFERT, P

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Electroosmotic pump using nanoporous dielectric frit von List, R. Scott, Myers, Alan, Vu, Quat T

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Microelectronic substrates with integrated devices von Vu, Quat T, Li, Jian, Towle, Steven

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Method for packaging a microelectronic device using on-die bond pad expansion von Towle, Steven, Jones, Martha, Vu, Quat T

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METHOD OF MAKING A SDI ELECTROOSMOTIC PUMP USING NANOPOROUS DIELECTRIC FRIT von QUAT VU, R. SCOTT LIST, ALAN MYERS

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Specific contact resistance extraction from four-point-probe measurements on multilayered film structures von Vu, Quat T., Kolawa, E., Halperin, L., Nicolet, M.-A.

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Electroosmotic pump using nanoporous dielectric frit von List, R, Myers, Alan, Vu, Quat

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Microelectronic substrate with integrated devices von Vu, Quat T, Li, Jian, Towle, Steven

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Integrated re-combiner for electroosmotic pumps using porous frits von Kim, Sarah E, List, R. Scott, Maveety, James G, Myers, Alan M, Vu, Quat T

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Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips von Kim, Sarah E, List, R. Scott, Maveety, James G, Myers, Alan M, Vu, Quat T

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Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures von Mu, Chun, Ma, Qing, Vu, Quat, Towle, Steven

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Capacitor with carbon nanotubes von Mosley, Larry E, Vu, Quat T, Zhang, Yuegang

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Method for packaging a microelectronic device using on-die bond pad expansion von Towle, Steven, Jones, Martha, Vu, Quat

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Microelectronic device having signal distribution functionality on an interfacial layer thereof von Ton, Tuy, Vu, Quat, Towle, Steven

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Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby von Mu, Xiao-Chun, Ma, Qing, Vu, Quat

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