Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging von MURALI, S, SRIKANTH, N, WONG, Y. M, VATH, Charles J

Volltext

Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage von Vath, Charles J., Gunasekaran, M., Malliah, Ramkumar

Volltext

An analysis of intermetallics formation of gold and copper ball bonding on thermal aging von Murali, S, Srikanth, N, Vath, Charles J

Volltext

Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding von Murali, S, Srikanth, N, Vath, Charles J

Volltext

Effect of wire diameter on the thermosonic bond reliability von Murali, Sarangapani, Srikanth, Narasimalu, Vath, Charles J.

Volltext

Effect of indenter shapes on bond pad hardness studies of low- k devices von Srikanth, Narasimalu, Tiong, Lim Chee, Vath, Charles J.

Volltext

An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing von Murali, S, Srikanth, N, Vath, Charles J

Volltext

Critical study of thermosonic copper ball bonding von Srikanth, N., Murali, S., Wong, Y.M., Vath, Charles J.

Volltext

Adhesion improvement of EMC–leadframe interface using brown oxide promoters von Srikanth, Narasimalu, Chan, Lewis, Vath, Charles J.

Volltext

Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer von Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y

Volltext

Direct gold and copper wires bonding on copper von Ho, Hong Meng, Lam, Wai, Stoukatch, Serguei, Ratchev, Petar, Vath, Charles J., Beyne, Eric

Volltext

Part II: Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding of 6-mil-diameter wire von Murali, S., Srikanth, N., Vath, Charles J.

Volltext

Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage: COPPER WIRE BONDING von VATH, Charles J, GUNASEKARAN, M, MALLIAH, Ramkumar

Volltext

Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds von Murali, S., Srikanth, N., Vath, Charles J.

Volltext

Cost-effective Use of Gold Wire in Semiconductor Packaging von Vath, Charles J., Holliday, Richard

Volltext

Development of compliant coating system for transfer molding of sensitive silicon dice von Srikanth, N., Kuah, T.H., Ho, S.C., Vath, Charles J.

Volltext

Development of Large Die Fine-Pitch Cu/Low-[Formula Omitted] FCBGA Package With Through Silicon via (TSV) Interposer von Chai, Tai Chong, Zhang, Xiaowu, Lau, John H, Selvanayagam, Cheryl S, Damaruganath, Pinjala, Hoe, Yen Yi Germaine, Ong, Yue Ying, Rao, Vempati Srinivas, Wai, Eva, Li, Hong Yu, Liao, E. Bin, Ranganathan, Nagarajan, Vaidyanathan, Kripesh, Liu, Shiguo, Sun, Jiangyan, Ravi, Mullapudi, Vath, Charles J, Tsutsumi, Yoshihiro

Volltext

Critical study of thermosonic copper ball bonding von SRIKANTH, N, MURALI, S, WONG, Y. M, VATH, Charles J

Volltext

Bonding Wire options and their impact on product reliability von Vath, Charles J., Holliday, R.

Volltext bestellen

Bonding wire options and their impact on product reliability von Vath, C. J., Holliday, R.

Volltext bestellen