Treffer 1 - 8 von 8 für Suche 'VARIN SRIBOONLUE', Suchdauer: 0,51s Treffer weiter einschränken
  1. 1
    Measurement-and-Simulation-Based Determination of Electrical Properties of Au-Ni Composite Pins in Elastomeric Sockets

    Measurement-and-Simulation-Based Determination of Electrical Properties of Au-Ni Composite Pins in Elastomeric Sockets von Ozbayat, Selman, Sriboonlue, Varin, Wang, Tao, Luevano, Gerardo Romo, Shin, Jaemin, Michalka, Tim


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  2. 2
    Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces

    Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces von May, Michael Randy, Zhang, Gary Yao, Sriboonlue, Varin, Chen, Nelly, Gopalan Uppili, Shrinivas

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  3. 3
    APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA) ASSIGNMENT AND A PCB CIRCUIT TRACE BREAKOUT PATTERN FOR RF CHIP INTERFACES

    APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA) ASSIGNMENT AND A PCB CIRCUIT TRACE BREAKOUT PATTERN FOR RF CHIP INTERFACES von CHEN, Nelly, ZHANG, Gary Yao, MAY, Michael Randy, GOPALAN UPPILI, Shrinivas, SRIBOONLUE, Varin

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  4. 4
    APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA) ASSIGNMENT AND A PCB CIRCUIT TRACE BREAKOUT PATTERN FOR RF CHIP INTERFACES

    APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA) ASSIGNMENT AND A PCB CIRCUIT TRACE BREAKOUT PATTERN FOR RF CHIP INTERFACES von CHEN, Nelly, ZHANG, Gary Yao, MAY, Michael Randy, GOPALAN UPPILI, Shrinivas, SRIBOONLUE, Varin

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  5. 5
    APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA) ASSIGNMENT AND A PCB CIRCUIT TRACE BREAKOUT PATTERN FOR RF CHIP INTERFACES

    APPARATUS AND METHOD FOR PROVIDING A SCALABLE BALL GRID ARRAY (BGA) ASSIGNMENT AND A PCB CIRCUIT TRACE BREAKOUT PATTERN FOR RF CHIP INTERFACES von CHEN, Nelly, ZHANG, Gary Yao, MAY, Michael Randy, GOPALAN UPPILI, Shrinivas, SRIBOONLUE, Varin

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  6. 6
    RF 칩 인터페이스들에 대해 스케일러블 볼 그리드 어레이 (BGA) 할당 및 PCB 회로 트레이스 브레이크아웃 패턴을 제공하기 위한 장치 및 방법

    RF 칩 인터페이스들에 대해 스케일러블 볼 그리드 어레이 (BGA) 할당 및 PCB 회로 트레이스 브레이크아웃 패턴을 제공하기 위한 장치 및 방법... von ZHANG GARY YAO, MAY MICHAEL RANDY, SRIBOONLUE VARIN, CHEN NELLY, GOPALAN UPPILI SHRINIVAS

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  7. 7
    APARELHO E MÉTODO PARA FORNECER UMA DESIGNAÇÃO DE CONJUNTO DE MATRIZ DE GRADE DE ESFERAS (BGA) ESCALONÁVEL E UM PADRÃO DE FUGA DE TRAÇO DE CIRCUITO PCB PARA INTERFACES DE CHIP DE RF

    APARELHO E MÉTODO PARA FORNECER UMA DESIGNAÇÃO DE CONJUNTO DE MATRIZ DE GRADE DE ESFERAS (BGA) ESCALONÁVEL E UM PADRÃO DE FUGA DE TRAÇO DE CIRCUITO PCB PARA INTERFACES DE CHIP DE R... von NELLY CHEN, MICHAEL RANDY MAY, SHRINIVAS GOPALAN UPPILI, GARY YAO ZHANG, VARIN SRIBOONLUE

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  8. 8
    Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces

    Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces von SRIBOONLUE, VARIN, ZHANG, GARY YAO, GOPALAN UPPILI, SHRINIVAS, CHEN, NELLY NI-LI, MAY, MICHAEL RANDY

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