Modelling of the bending strength of refractory materials at elevated temperatures von Macháček, Jan, Hamáček, Jiří, Urbánek, Jan, Hlinčík, Tomáš

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Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys von J. Podzemsky, V. Papez, J. Urbanek, K. Dusek

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Kraftfahrzeugleuchte und Kraftfahrzeug von Urbanek, Jan

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Test of wettability of lead-free solders von Podzemsky, J., Urbanek, J.

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Shear strength of joints made of lead-free solders von Podzemsky, J., Urbanek, J., Dusek, K.

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Fermentations from structured aqueous media and cosmetic compositions comprising them von SOLIS PETER J, MAMMON TIMOTHY, URBANEK JAN, NOVICH ANDREW M

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Mechanical stress tests of SMT attachments von Zak, P., Tucan, M., Urbanek, J.

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Post-curing behavior of two-component Electrically Conductive Adhesive von Zak, P., Tucan, M., Urbanek, J.

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Double row cylindrical roller bearing with laser textured elements von ROŻNIATOWSKI, KRZYSZTOF, URBANEK, JAN, NAPADŁEK, WOJCIECH, STUDZIŃSKI, PAWEŁ, CHRZANOWSKI, WOJCIECH

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Double row cylindrical roller bearing with laser textured elements von ROŻNIATOWSKI, KRZYSZTOF, URBANEK, JAN, NAPADŁEK, WOJCIECH, STUDZIŃSKI, PAWEŁ, CHRZANOWSKI, WOJCIECH

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Landscapes and Landforms of Slovakia von Lehotsky, Milan, Boltiziar, Martin

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Tre Kvantitativa Metoder Metodeffekt vid kvantitativa datainsamlingsmetoder i IT-supportrelaterade frågor von Urbanek Jan 1989- , Linnéuniversitetet, Institutionen för datavetenskap, fysik och matematik, DFM, Urbanek Jan 1989-, Linnaeus University, Department of Computer Science, Physics and Mathematics, DFM

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Degradation of two-compound Electrically Conductive Adhesive in relation to curing temperature profile von Tucan, M., Zak, P., Urbanek, J.

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Study of influences on the changes of the surface tension von Dusek, K., Urbanek, J.

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A Note on Some Limitations in the Wetting-Balance Measurements and How to Deal with Them von Klabacka, E., Urbanek, J.

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Rozvoj inovačních aktivit MSP v operačních programech ČR von Urbánek, Jan

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Wetting Force Measurement of the Different Types of Solders and Testing Materials von Dusek, K., Urbanek, J., Mach, P., Drapala, J.

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Evaluation of tin whisker growth von Jiri, P, Martin, C, Jan, U, Karel, D

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Podpora MSP v rámci dotačních zdrojů evropské územní spolupráce von Urbánek, Jan

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Gloves with bare finish von URBANEK JAN

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