Development of High-Speed Rotation Polishing System with Slurry Confinement and Friction-State Control von Yoshitomi, Kenichiro, Shimada, Yoshinori, Une, Atsunobu

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Study of the Warp Removal Process for a Thin Substrate: Development of a Correction Processing System Using a Freezing Pin Chuck von Yoshitomi, Kenichiro, Une, Atsunobu

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Study of a clamping process with no deformation for a thin substrate using a freezing pin chuck system von Yoshitomi, Kenichiro, Une, Atsunobu, Tada, Kazuki

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Double-Sided Polishing Simulation Based on the Gap Theory - Theory of Pressure Distribution Analysis and Conditions for High Flatness von YOSHITOMI, Kenichiro, UNE, Atsunobu

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Development of a nondeforming chucking technique for EUV lithography von Une, Atsunobu, Ogasawara, Nagahisa, Yoshitomi, Kenichiro, Mochida, Masaaki

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Ultra Precision Polishing with Oscillation Speed Control: an Analysis of the Pressure Distribution and Profile von Une, Atsunobu, Mochida, Masaaki, Yoshitomi, Kenichiro

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Dynamic deformation of a wafer above a lift hole and influence on flatness due to chucking von Une, Atsunobu, Yoshitomi, Kenichiro, Mochida, Masaaki

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Development of a nondeforming chucking technique for EUV lithography : Emerging materials and processes for nanoelectronics and sensors von UNE, Atsunobu, OGASAWARA, Nagahisa, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

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Lapping Simulation Based on the Gap Theory (1st Report): Contact Condition between Workpiece and Tool and Relative Elastic Coefficient von UNE, Atsunobu, GOTO, Kenji, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

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Reduction of Slurry Flow Rate in Oscillation Polishing Using a Small Tool von YOSHITOMI, Kenichiro, UNE, Atsunobu, MOCHIDA, Masaaki

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High Flatness Polishing of Rectangular Glass Materials (2nd Report): Generation of a Center-axisymmetric Shape by Grinding and Compensation Method of Tool Inclination for Polishing... von UNE, Atsunobu, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

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Influence of pin chuck ring seals and polishing steps on wafer flatness von Une, Atsunobu, Yoshitomi, Kenichiro, Mochida, Masaaki, Ogasawara, Nagahisa

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Planarization for a Large-sized Wafer by Correction Polishing (1st Report): Pressure Distribution and Contact State between a wafer and a polisher von YOSHITOMI, Kenichiro, UNE, Atsunobu, MOCHIDA, Masaaki

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Fabrication of micro patterns using a drawing system with an air-pulse-type dispenser von YOSHITOMI, Kenichiro, UNE, Atsunobu, MOCHIDA, Masaaki

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Development of a Water-Film Chuck (2nd Report): Thinning Method of Water-Film and Wafer Thinning by Grinding von YOSHITOMI, Kenichiro, UNE, Atsunobu, BANDO, Tsubasa, YAMAMOTO, Eiichi

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Lapping Simulation Based on the Gap Theory (2nd Report): Oscillation Lapping with a Small Tool von UNE, Atsunobu, GOTO, Kenji, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

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Influence of a lift hole-equipped pin chuck on wafer flatness von Une, Atsunobu, Ogasawara, Nagahisa, Fukuda, Tetsuo, Yoshise, Masanori, Xin, Ping

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Fabrication of micro patterns using a drawing system with an air-pulse-type dispenser von Yoshitomi, Kenichiro, Une, Atsunobu, Mochida, Masaaki

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High Flatness Polishing of Rectangular Glass Materials (1st Report): Simulation of Rectangular Plane Generation by Linear Oscillation von UNE, Atsunobu, YOSHITOMI, Kenichiro, MOCHIDA, Masaaki

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Development of a Water-film Chuck (1st Report): Sticking Force Utilizing Meniscus Force and Flattening of Warpage von YOSHITOMI, Kenichiro, UNE, Atsunobu, OGASAWARA, Nagahisa, MOCHIDA, Masaaki

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