Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition von Li, Wangyun, Chen, Chuantong, Nishijima, Masahiko, Ueshima, Minoru, Nishikawa, Hiroshi, Suganuma, Katsuaki

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Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock von Liu, Yang, Chen, Chuantong, Zhang, Zheng, Ueshima, Minoru, Sakamoto, Takeshi, Naoe, Takuya, Nishikawa, Hiroshi, Oda, Yukinori, Suganuma, Katsuaki

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Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature von Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Hirahara, Hidetoshi, Sang, Jing, Cho, Sung hun, Sekino, Tohru, Suganuma, Katsuaki

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Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding von Nakayama, Koji S., Nishijima, Masahiko, Zhang, Yicheng, Chen, Chuantong, Ueshima, Minoru, Suganuma, Katsuaki

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Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules von Xu, Yuxin, Qiu, Xiaoming, Li, Wangyun, Wang, Suyu, Ma, Ninshu, Ueshima, Minoru, Chen, Chuantong, Suganuma, Katsuaki

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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C von Li, Wanli, Li, Cai-Fu, Lang, Fengpei, Jiu, Jinting, Ueshima, Minoru, Wang, Hao, Liu, Zhi-Quan, Suganuma, Katsuaki

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Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current von Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg

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Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements von Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg

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Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors von Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Suganuma, Katsuaki

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Self-assembled layer as an effective way to block copper diffusion into epoxy von Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki

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Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components von Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg

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Copper diffusion into epoxy under high temperature von Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki

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Effects of high temperature and high humidity on the reliability of copper/epoxy bond von Zhao, Shuaijie, Chen, Chuantong, Nishijima, Masahiko, Okumura, Rieko, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Suganuma, Katsuaki

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Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate von Zhao, Shuaijie, Chen, Chuantong, Haga, Motoharu, Ueshima, Minoru, Suzuki, Hirose, Takenaka, Hiroto, Hirahara, Hidetoshi, Sang, Jing, Suganuma, Katsuaki

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Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation von Liu, Yang, Chen, Chuantong, Wang, Ye, Zhang, Zheng, Liu, Ran, Ueshima, Minoru, Ota, Ichiro, Nishikawa, Hiroshi, Nishijima, Masahiko, Nakayama, Koji S., Suganuma, Katsuaki

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Relationship between Reliability and Effect of Solid Solution Hardening at Solder Joints von Ueshima, Minoru

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Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method von Ode, Machiko, Ueshima, Minoru, Abe, Taichi, Murakami, Hideyuki, Onodera, Hidehiro

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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °CElectro... von Li, Wanli, Li, Cai-Fu, Lang, Fengpei, Jiu, Jinting, Ueshima, Minoru, Wang, Hao, Liu, Zhi-Quan, Suganuma, Katsuaki

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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints von Lee, Kiju, Kim, Keun-Soo, Tsukada, Yutaka, Suganuma, Katsuaki, Yamanaka, Kimihiro, Kuritani, Soichi, Ueshima, Minoru

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Study on Whisker Growth on Solder Joints-Part I: Study on Acceleration Test Method von Tsukui, Tsutomu, Takeuchi, Yoshihiro, Ueshima, Minoru, Takenaka, Junichi, Takeuchi, Makoto, Sasaki, Kihichi, Kobayashi, Yoshikazu, Sasabe, Toshiki

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