Electrical Characteristics of p–i–n Mesa-Photodiodes Based on InGaAs/InP Heterostructures von Gogorishvili, I., Tutunjyan, A., Sakharova, T., Melikyan, M., Khuchua, N., Kuparashvili, D.

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RIE dynamics for extreme wafer thinning applications von Rassoul, Nouredine, Jourdain, Anne, Tutunjyan, Nina, De Vos, Joeri, Sardo, Stefano, Inoue, Fumihiro, Piumi, Daniele, Beyer, Gerald, Miller, Andy, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansel, Oliver, Ashraf, Huma, Hopkins, Janet, Thomas, Dave

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Etch process modules development and integration in 3D-SOC applications von Tutunjyan, Nina, Sardo, Stefano, De Vos, Joeri, Van Huylenbroeck, Stefaan, Jourdain, Anne, Peng, Lan, Inoue, Fumihiro, Rassoul, Nouredine, Beyer, Gerald, Beyne, Eric, Miller, Andy, Piumi, Daniele

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Silicon Based System for Single-Nucleotide-Polymorphism Detection: Chip Fabrication and Thermal Characterization of Polymerase Chain Reaction Microchamber von Majeed, Bivragh, Jones, Ben, Tezcan, Deniz S, Tutunjyan, Nina, Haspeslagh, Luc, Peeters, Sara, Fiorini, Paolo, Beeck, Maaike Op de, Hoof, Chris Van, Hiraoka, Maki, Tanaka, Hiroyuki, Yamashita, Ichiro

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Silicon Based System for Single-Nucleotide-Polymorphism Detection: Chip Fabrication and Thermal Characterization of Polymerase Chain Reaction Microchamber von Majeed, Bivragh, Jones, Ben, Tezcan, Deniz S., Tutunjyan, Nina, Haspeslagh, Luc, Peeters, Sara, Fiorini, Paolo, Beeck, Maaike Op de, Hoof, Chris Van, Hiraoka, Maki, Tanaka, Hiroyuki, Yamashita, Ichiro

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Thin MEMS Packages Obtained by a Novel Collective Cap Transfer Process von Phommahaxay, Alain, Bogaerts, Lieve, Naito, Yasuyuki, Van Cauwenberghe, Marc, Tutunjyan, Nina, Onishi, Keiji, Tilmans, Harrie A.C.

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Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design von Andrei, A., Tutunjyan, N., Verbinnen, G., VanPut, S., Krylychkina, O., Eberle, W., Musa, S.

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Silicon micro-pillar filter fabrication for DNA separation in Lab-on-chip system von Majeed, B., Lei Zhang, Tutunjyan, N., Jones, B., Fiorini, P., Tezcan, D. S.

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Process integration solution for damage-free bevel for deep Si etch applications von Majeed, Bivragh, Tutunjyan, Nina, Fiorini, Paolo, Tezcan, Deniz. S.

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Si Fabrication Technologies for Biomedical Applications: Double Stranded DNA Separation von Majeed, Bivragh, Zhang, Lei, Tutunjyan, Nina, Tezcan, Deniz Sabuncuoglu, Fiorini, Paolo

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Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding von Pham, N. P., Cherman, V., Vandevelde, B., Limaye, P., Tutunjyan, N., Jansen, R., Van Hoovels, N., Tezcan, D. S., Soussan, P., Beyne, E., Tilmans, H. A. C.

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Process challenges in 0-level packaging using 100μm-thin chip capping with TSV von Pham, Nga P., Cherman, Vladimir, Tutunjyan, Nina, Teugels, Lieve, Tezcan, Deniz S., Tilmans, Harrie A.C.

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Method for etching 3d structures in a semiconductor substrate, including surface preparation von TUTUNJYAN, NINA, VAN CAUWENBERGHE, MARC, PHOMMAHAXAY, ALAIN, COTRIN TEIXEIRA, RICARDO, VERDONCK, PATRICK

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Method for etching 3d structures in a semiconductor substrate, including surface preparation von TUTUNJYAN, NINA, VAN CAUWENBERGHE, MARC, PHOMMAHAXAY, ALAIN, COTRIN TEIXEIRA, RICARDO, VERDONCK, PATRICK

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METHOD FOR ETCHING 3D STRUCTURES IN A SEMICONDUCTOR SUBSTRATE, INCLUDING SURFACE PREPARATION von TUTUNJYAN NINA, VERDONCK PATRICK, VAN CAUWENBERGHE MARC, PHOMMAHAXAY ALAIN, COTRIN TEIXEIRA RICARDO

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Method for stacking semiconductor chips von TILMANS, HENDRIKUS, BOGAERTS, LIEVE, TUTUNJYAN, NINA, BUISSON, THIBAULT, VAN CAUWENBERGHE, MARC, PHOMMAHAXAY, ALAIN, IKER, FRANCOIS, JOUDAIN, ANNE

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