Effect of the thickness on the fracturing behavior of discontinuous fiber composite structures von Ko, Seunghyun, Davey, James, Douglass, Sam, Yang, Jinkyu, Tuttle, Mark E., Salviato, Marco

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Resistive embedded heating for homogeneous curing of adhesively bonded joints von Ashrafi, Mahdi, Devasia, Santosh, Tuttle, Mark E.

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Boundary Control of Embedded Heaters for Uniform Bondline Temperatures During Composite Joining von Smith, Brandon P, Ashrafi, Mahdi, Tuttle, Mark E, Devasia, Santosh

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Embedded resistive heating in composite scarf repairs von Ashrafi, Mahdi, Smith, Brandon P, Devasia, Santosh, Tuttle, Mark E

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Bondline Temperature Control for Joining Composites With an Embedded Heater von Smith, Brandon P, Ashrafi, Mahdi, Tuttle, Mark E, Devasia, Santosh

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Effect of the platelet size on the fracturing behavior and size effect of discontinuous fiber composite structures von Ko, Seunghyun, Yang, Jinkyu, Tuttle, Mark E., Salviato, Marco

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Measurement of Strain Gradients Using Digital Image Correlation by Applying Printed-Speckle Patterns von Ashrafi, Mahdi, Tuttle, Mark E.

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The Nonlinear Viscoelastic-Viscoplastic Behavior of IM7/5260 Composites Subjected to Cyclic Loading von Tuttle, Mark E., Pasricha, Arun, Emery, Ashley F.

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Optimal design of large composite panels with varying loads von Kristinsdottir, Birna P., Zabinsky, Zelda B., Tuttle, Mark E., Neogi, Sudipto

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Optimization of composite I-sections using fiber angles as design variables von Savic, Vesna, Tuttle, Mark E., Zabinsky, Zelda B.

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A Study of Composite Angle Beams Produced using a Discontinuous Fiber Composite von SHIFMAN, Tory J., TUTTLE, Mark E.

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Solder removal from semiconductor devices von Tuttle, Mark E

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Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods von Tuttle, Mark E

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ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AND RELATED SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS von Tuttle, Mark E, Nakano, Eiichi

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A LABORATORY DEMONSTRATION OF PURE BENDING OF UNSYMMETRIC BEAMS von Tuttle, Mark E.

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Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods von Tuttle, Mark E, Nakano, Eiichi

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SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES von Tuttle, Mark E

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Solder removal from semiconductor devices von Tuttle, Mark E

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ELECTRONIC DEVICE WITH A CARD-LEVEL THERMAL REGULATOR MECHANISM AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS von Tuttle, Mark E

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APPARATUS, METHODS AND SYSTEMS FOR THERMALLY ISOLATED SIGNAL AND POWER TRANSMISSION von Tuttle, Mark E

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