Silicon-Based White LED Packaging Module With an Integrated RGB Color Sensor von Chunyu Chen, Chingfu Tsou

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Novel Silicon-Based LED Packaging Module With an Integrated Photosensing Element von Tseng, Kuochun, Tsou, Chingfu

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Thermal Bubble Microfluidic Gate Based on SOI Wafer von Tsou, Chingfu, Huang, Chenghan

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A Silicon-Based Photosensor With Photosensitive Cavity Structure von Huang, Yuanyuan, Tsou, Chingfu

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The implementation of a thermal bubble actuated microfluidic chip with microvalve, micropump and micromixer von Huang, Chenghan, Tsou, Chingfu

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Integration and Encapsulation of Light-Emitting Diode and CMOS-MEMS Chips for Fluorescence Quenching Gas Sensor von Lee, Ya-Chu, Liou, Cheng-Shiun, Chien, Tung-Lin, Tsou, Chingfu, Fang, Weileun

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Monolithically GaN-based Optocoupler with Chip Scaling von Liou, Chengshiun, Tsou, Chingfu

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HBV infection increases the risk of macular degeneration: the roles of HBx-mediated sensitization of retinal pigment epithelial cells to UV and blue light irradiation von Chou, Ruey-Hwang, Lee, Chang-Yin, Chong, Lee-Won, Chang, Kuang-Hsi, Lin, Cheng-Li, Yan, Ke-Sin, Tsou, Chingfu, Hsu, Yi-Chao

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A Novel Micromachined Claw Probe for the Electrical Testing of Microsolder Ball von Tsou, Chingfu, Lai, Tengshian, Huang, Chenghan

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A New Method for Microlens Fabrication by a Heating Encapsulated Air Process von Tsou, Chingfu, Lin, Chewei

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An Improved Process for Fabricating Microlens Array With High Fill Factor and Controllable Configuration von TSOU, Chingfu, LIN, Chienhung

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A Monolithic Micromachined Thermocouple Probe With Electroplating Nickel for Micro-LED Inspection von Shih, Fuchi, Tsou, Chingfu, Fang, Weileun

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The implementation and performance evaluation of a silicon-based LED packaging module with lens configuration von Tsou, Chingfu, Chang, Chunming, Lai, Tenghsien, Huang, Chenghan

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A Silicon-Based LED Packaging Module With a Temperature-Dependent Capacitor for Constant Voltage Control von Huang, Lisheng, Liao, Siansyun, Tsou, Chingfu, Hung, San-Shan

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Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology von Hu, Zihsong, Liou, Chengshiun, Tsou, Chingfu

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Compact Dual-LED Packaging With a 3-D Free-Form Lens for Uniform Rectangular Illumination von Liou, Chengshiun, Tsou, Chingfu

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A novel sensing chip with dual-coil inductance for determining raw milk quality von Li, Weichen, Liao, Siansyun, Tsou, Chingfu

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A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor von Chang, Shengwei, Tsou, Chingfu

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Usage of the impedance effect of a spiral dual-coil for fingerprint sensor application von Lin, Shihwei, Hsieh, Mingyu, Huang, Yuanyuan, Shih, Fuchi, Hu, Zihsong, Fang, Weileun, Tsou, Chingfu

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Optically Driven Mobile Integrated Micro-Tools for a Lab-on-a-Chip von Liu, Yi-Jui, Lee, Yi-Hsiung, Lin, Yu-Sheng, Tsou, Chingfu, Baldeck, Patrice, Lin, Chih-Lang

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